Browsing by author "Vega Gonzalez, Victor"
Now showing items 1-20 of 37
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
Alternative metal recess for fully-self-aligned-vias
Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020) -
Barrier/liner stacks for scaling the Cu interconnect metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects
Jourdan, Nicolas; van der Veen, Marleen; Vega Gonzalez, Victor; Croes, Kristof; Lesniewska, Alicja; Varela Pedreira, Olalla; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Design, patterning, and process integration overview for 2nm node
Sherazi, Yasser; Chang, Yi-Han; Drissi, Youssef; Chehab, Bilal; Vega Gonzalez, Victor; Kim, Ryan Ryoung Han; Lee, Jae Uk (2022) -
Development of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning
Kesters, Els; Le, Quoc Toan; Decoster, Stefan; Vega Gonzalez, Victor; Holsteyns, Frank; De Gendt, Stefan (2015) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
Electromigration and thermal storage study of barrierless Co vias
Varela Pedreira, Olalla; Croes, Kristof; Zahedmanesh, Houman; Vandersmissen, Kevin; van der Veen, Marleen; Vega Gonzalez, Victor; Dictus, Dries; Zhao, Larry; Kolics, Artur; Tokei, Zsolt (2018) -
Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
Montero Alvarez, Daniel; Vega Gonzalez, Victor; Feurprier, Yannick; Varela Pedreira, Olalla; Oikawa, Noriaki; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Versluijs, Janko; De Coster, Hanne; Bazzazian, Nina; Jourdan, Nicolas; Kumar, Kaushik; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2022-06-29) -
Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
Armini, Silvia; Lesniewska, Alicja; Jourdan, Nicolas; Delande, Tinne; Vega Gonzalez, Victor; Wilson, Chris; Struyf, Herbert; Tokei, Zsolt (2017) -
Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects
Payne, Makonnen; Lippy, Steve; Lieten, Ruben; Kesters, Els; Le, Quoc Toan; Murdoch, Gayle; Vega Gonzalez, Victor; Holsteyns, Frank (2016) -
Exploring the use of Tungsten-based Hard Masks in BEOL interconnects for 3nm node and beyond
Montero Alvarez, Daniel; Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Nie, Jiuyuan; Yang, Jialing; Schleicher, Filip; Mclaughlin, Kevin; Versluijs, Janko; Lazzarino, Frederic; Park, Seongho; Tokei, Zsolt (2022-11-10) -
Extending the Cu metallization and alternatives
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Vandersmissen, Kevin; Wilson, Chris; Varela Pedreira, Olalla; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2017) -
Extreme contact shrink for back end of line connectivity
Schleicher, Filip; Paolillo, Sara; Decoster, Stefan; Wu, Chen; Vega Gonzalez, Victor; Hasan, Mahmudul; Beral, Christophe; Lazzarino, Frederic (2022-05-10) -
High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond
Puliyalil, Harinarayanan; Feurprier, Yannick; Oikawa, Noriaki; Vega Gonzalez, Victor; Briggs, Basoene; Montero Alvarez, Daniel; Lazzarino, Frederic; Tokei, Zsolt; Satoru, Nakamura; Tahara, Shigeru; Kumar, Kaushik (2021) -
Hybrid Metallization with Cu in sub 30nm Interconnects
van der Veen, Marleen; Soethoudt, Job; Delabie, Annelies; Varela Pedreira, Olalla; Vega Gonzalez, Victor; Lariviere, Stephane; Teugels, Lieve; Jourdan, Nicolas; Decoster, Stefan; Struyf, Herbert; Wilson, Chris; Croes, Kristof; Tokei, Zsolt (2020) -
Impact of wire geometry on interconnect RC and circuit delay
Ciofi, Ivan; Contino, Antonino; Roussel, Philippe; Baert, Rogier; Vega Gonzalez, Victor; Croes, Kristof; Badaroglu, Mustafa; Wilson, Chris; Raghavan, Praveen; Mercha, Abdelkarim; Verkest, Diederik; Groeseneken, Guido; Mocuta, Dan; Thean, Aaron (2016) -
In-line Metrology for Vertical Edge Placement Control of Monolithic CFET using CD-SEM
Sun, Wei; Doi, Ayumi; Isawa, Miki; Vega Gonzalez, Victor; Tokei, Zsolt; Lorusso, Gian (2023)