Browsing by imec author "921108aa6e49815c469aa0857c5d40e294dfa3b1"
Now showing items 1-20 of 43
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12-EUV layer Surrounding Gate Transistor (SGT) for vertical 6-T SRAM: 5-nm-class technology for ultra-density logic devices
Kim, Min-Soo; Harada, N.; Kikuchi, Yoshiaki; Boemmels, Juergen; Mitard, Jerome; Huynh Bao, Trong; Matagne, Philippe; Tao, Zheng; Li, Waikin; Devriendt, Katia; Ragnarsson, Lars-Ake; Lorant, Christophe; Sebaai, Farid; Porret, Clément; Rosseel, Erik; Dangol, Anish; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Jourdan, Nicolas; Sepulveda Marquez, Alfonso; Puliyalil, Harinarayanan; Jamieson, Geraldine; van der Veen, Marleen; Teugels, Lieve; El-Mekki, Zaid; Altamirano Sanchez, Efrain; Li, Y.; Nakamura, H.; Mocuta, Dan; Matsuoka, F. (2019) -
3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers
Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
3D integration technology using W2W direct bonding and TSV
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Jamieson, Geraldine; Tutunjyan, Nina; Peng, Lan; Volkaerts, Danny (2015) -
3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018-11) -
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A descum review for cleaning surfaces in polymer embedded process flows
Jamieson, Geraldine; Iker, Francois; Takeshi, Kita; Duval, Fabrice; Pham, Nga; Gerets, Carine; Boullart, Werner; Funaya, T. (2010) -
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
Alternative metals: from ab initio screening to calibrated narrow line models
Adelmann, Christoph; Sankaran, Kiroubanand; Dutta, Shibesh; Gupta, Anshul; Kundu, Shreya; Jamieson, Geraldine; Moors, Kristof; Pinna, Nicolo; Ciofi, Ivan; Van Elshocht, Sven; Boemmels, Juergen; Boccardi, Guillaume; Wilson, Chris; Pourtois, Geoffrey; Tokei, Zsolt (2018) -
Alternative patterning techniques enabling fine pitch interconnection on topography surfaces
Iker, Francois; Funaya, Takuo; Jamieson, Geraldine; Beyne, Eric (2010) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019) -
CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device
Severi, Simone; Heck, J.; Chou, T.K.A.; Belov, N.; Park, J.S.; Harrar, D.; Jain, A.; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; Varela Pedreira, Olalla; Willegems, Myriam; Vaes, Jan; Jamieson, Geraldine; Haspeslagh, Luc; Adams, D.; Rao, V.; Decoutere, Stefaan; Witvrouw, Ann (2009) -
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; De Preter, Inge; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy (2022) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Direct metal nanowire patterning using ion beam etch
Kundu, Shreya; Dutta, Shibesh; Gupta, Anshul; Jamieson, Geraldine; Piumi, Daniele; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Adelmann, Christoph (2017) -
Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices
Seema Saseendran, Sandeep; Paneri, Abhilash; Tobback, Bert; Kutrzeba Kotowska, Bogumila; Vecchio, Emma; Jamieson, Geraldine; Paraschiv, Vasile; Figeys, Bruno; Suh, Hyo Seon; Sabuncuoglu Tezcan, Deniz; Takahashi, Kohei; Fujikane, Masaki; Himeno, Atsushi; Nakamura, Kunihiko; Tambo, Naoki; Nakata, Yuki; Tanaka, Hiroyuki; Naito, Yasuyuki (2020) -
First demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers
Vandooren, Anne; Franco, Jacopo; Wu, Zhicheng; Parvais, Bertrand; Li, Waikin; Walke, Amey; Peng, Lan; Deshpande, Paru; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Mannaert, Geert; Chan, BT; Ritzenthaler, Romain; Mitard, Jerome; Ragnarsson, Lars-Ake; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018) -
High-aspect-ratio ruthenium lnes for buried power rail
Gupta, Anshul; Kundu, Shreya; Teugels, Lieve; Boemmels, Juergen; Adelmann, Christoph; Heylen, Nancy; Jamieson, Geraldine; Varela Pedreira, Olalla; Ciofi, Ivan; Chava, Bharani; Wilson, Chris; Tokei, Zsolt (2018)