Browsing by author "Lesniewska, Alicja"
Now showing items 1-20 of 36
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
Accelerated device degradation analysis on high speed Ge waveguide photodetectors
Lesniewska, Alicja; Srinivasan, Ashwyn; Van Campenhout, Joris; O'Sullivan, Barry; Croes, Kristof (2019) -
Area-Selective Deposition of AlOx and Al-Silicate for Fully Self- Aligned Via Integration
Pasquali, Mattia; Brady-Boyd, Anita; Lesniewska, Alicja; Carolan, Patrick; Conard, Thierry; O'Connor, Robert; De Gendt, Stefan; Armini, Silvia (2023) -
Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
Gupta, Anshul; Varela Pedreira, Olalla; Tao, Zheng; Mertens, Hans; Radisic, Dunja; Jourdan, Nicolas; Devriendt, Katia; Heylen, Nancy; Wang, Shouhua; Chehab, Bilal; Jang, Doyoung; Hellings, Geert; Sebaai, Farid; Lorant, Christophe; Teugels, Lieve; Peter, Antony; Chan, BT; Schleicher, Filip; Demonie, Ingrid; Marien, Philippe; Sepulveda Marquez, Alfonso; Richard, Olivier; Nagesh, Nishanth; Lesniewska, Alicja; Lazzarino, Frederic; Ryckaert, Julien; Morin, Pierre; Altamirano Sanchez, Efrain; Murdoch, Gayle; Boemmels, Juergen; Demuynck, Steven; Na, Myung Hee; Tokei, Zsolt; Biesemans, Serge; Dentoni Litta, Eugenio; Horiguchi, Naoto (2020) -
Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
van der Veen, Marleen; Vandersmissen, Kevin; Dictus, Dries; Demuynck, Steven; Liu, Ran; Bin, Xiaomin; Nalla, Praveen; Lesniewska, Alicja; Hall, Laurie; Croes, Kristof; Zhao, Larry; Boemmels, Juergen; Kolics, Artur; Tokei, Zsolt (2015) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials
Wu, Chen; Li, Yunlong; Lesniewska, Alicja; Varela Pedreira, Olalla; de Marneffe, Jean-Francois; Ciofi, Ivan; Verdonck, Patrick; Baklanov, Mikhaïl; Boemmels, Juergen; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2015) -
Cu passivation for integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt; De Gendt, Stefan; Baklanov, Mikhail (2016) -
CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects
Jourdan, Nicolas; van der Veen, Marleen; Vega Gonzalez, Victor; Croes, Kristof; Lesniewska, Alicja; Varela Pedreira, Olalla; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016) -
Degradation mechanisms in Germanium Electro-Absorption Modulators
Tsiara, Artemisia; Lesniewska, Alicja; Roussel, Philippe; Srinivasan, Ashwyn; Berciano, Mathias; Simicic, Marko; Pantouvaki, Marianna; Van Campenhout, Joris; Croes, Kristof (2022) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
Doped Ru to enable next generation barrier-less interconnect
Joi, A.; Lesniewska, Alicja; Dictus, Dries; Tso, K. C.; Venkatraman, K.; Dordi, J.; Croes, Kristof; Tokei, Zsolt; Yadav, S. K.; Wu, P. W. (2022) -
Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
Armini, Silvia; Lesniewska, Alicja; Jourdan, Nicolas; Delande, Tinne; Vega Gonzalez, Victor; Wilson, Chris; Struyf, Herbert; Tokei, Zsolt (2017) -
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP
Murdoch, Gayle; O'Toole, Martin; Marti, Giulio; Pokhrel, Ankit; Tsvetanova, Diana; Decoster, Stefan; Kundu, Souvik; Oniki, Yusuke; Thiam, Arame; Le, Quoc Toan; Varela Pedreira, Olalla; Lesniewska, Alicja; Martinez Alanis, Gerardo Tadeo; Park, Seongho; Tokei, Zsolt (2022-06-15) -
Impact of Mn-based barriers on dielectric breakdown voltage and capacitance
Lesniewska, Alicja; Wu, Chen; Jourdan, Nicolas; Briggs, Basoene; Boemmels, Juergen; Tokei, Zsolt; Croes, Kristof (2016) -
Impact of surface condition on Cobalt drift into LK3.0 films
Tierno, Davide; Lesniewska, Alicja; Kljucar, Luka; van der Veen, Marleen; Tokei, Zsolt; Croes, Kristof (2020) -
Integration of ultralow-k dielectrics using a template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Murdoch, Gayle; Vega Gonzalez, Victor; Verdonck, Patrick; Heylen, Nancy; Zha, Lichen; Wu, Chen; Lesniewska, Alicja; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Lefferts, Scott (2017) -
Interconnect metals beyond copper: reliability challenges and opportunities
Croes, Kristof; Adelmann, Christoph; Wilson, Chris; Zahedmanesh, Houman; Varela Pedreira, Olalla; Wu, Chen; Lesniewska, Alicja; Oprins, Herman; Beyne, Sofie; Ciofi, Ivan; Kocaay, Deniz; Stucchi, Michele; Tokei, Zsolt (2018) -
Intrinisic reliability of local interconnects for N7 and beyond
Croes, Kristof; Lesniewska, Alicja; Wu, Chen; Ciofi, Ivan; Banczerowska, Aga; Briggs, Basoene; Demuynck, Steven; Tokei, Zsolt; Boemmels, Juergen; Saad, Y.; Gao, Weimin (2015) -
Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects
Fang, Yu; Ciofi, Ivan; Roussel, Philippe; Lesniewska, Alicja; Degraeve, Robin; De Wolf, Ingrid; Croes, Kristof (2023)