Browsing by author "Meynen, Herman"
Now showing items 1-20 of 27
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A new ultra-low K ILD material based on organic-inorganic hybrid resins
Zhong, Ben; Meynen, Herman; Iacopi, Francesca; Weidner, Ken; Malhouitre, Stéphane; Moyer, Eric; Bargeron, Cory; Schalk, Paul; Peck, Alan; Van Hove, Marleen; Maex, Karen (2002) -
An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices
Hong, Eun Kee; Demuynck, Steven; Le, Quoc Toan; Baklanov, Mikhaïl; Carbonell, Laure; Van Hove, Marleen; Meynen, Herman (2007) -
Aspects of metal etching for interconnect technologies
Verdonck, P.; Meynen, Herman (1994) -
Development of a global planarization process without CMP
Forester, Lynn; Coenegrachts, Bart; Stone, M.; Meynen, Herman; Grillaert, Joost; Van den hove, Luc (1994) -
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Gonzalez, Mario; Vanden Bulcke, Mathieu; Vandevelde, Bart; Beyne, Eric; Lee, Yeong; Harkness, Brian; Meynen, Herman (2004) -
Influence of the antireflection coating on the electromigration resistance of 0.5 µm technology metal-2 line structures
Stevens, Rudi; Witvrouw, Ann; Roussel, Philippe; Maex, Karen; Meynen, Herman; Cuthbertson, Alan (1995) -
Integrating a hydrogen silsesquioxane spin-on dielectric in a quarter micron technology
Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Gao, Teng; Grillaert, Joost; Van den hove, Luc (1997) -
Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process
Gao, Teng; Gray, William; Van Hove, Marleen; Struyf, Herbert; Meynen, Herman; Vanhaelemeersch, Serge; Maex, Karen (2000) -
Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process
Gao, Teng; Gray, William; Van Hove, Marleen; Struyf, Herbert; Meynen, Herman; Vanhaelemeersch, Serge (1999) -
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998) -
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998) -
Interlevel dielectric engineering for improved device performance in half-micron CMOS
Forester, Lynn; Collins, Tom; Van den Bosch, Geert; Meynen, Herman; Coenegrachts, Bart; Van den hove, Luc (1994) -
Low-k materials etch and strip optimization for sub 0.25µm technology
Gao, Teng; Gray, William; Van Hove, Marleen; Rosseel, Erik; Struyf, Herbert; Meynen, Herman; Vanhaelemeersch, Serge; Maex, Karen (1999) -
Low-k organic spin-on materials in a non-etchback interconnect strategy
Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Grillaert, Joost; Van den hove, Luc (1996) -
Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables
Grillaert, Joost; Meynen, Herman; Waeterloos, Joost; Coenegrachts, Bart; Van den hove, Luc (1997) -
Optimization of etching and stripping chemistries for Z3MS TM low-k
Lepage, Muriel; Shamiryan, Denis; Baklanov, Mikhaïl; Struyf, Herbert; Mannaert, Geert; Vanhaelemeersch, Serge; Weidner, Ken; Meynen, Herman (2001) -
Patternable silicones for next generation packaging reliability requirements
Kunselman, Michael; Larson, Lyndon; Harkness, Brian; Gardner, Geoff; Alger, James; Cummings, Michelle; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Photopatternable silicone compositions for electronics packaging applications
Harkness, Brian R.; Gardner, Geoff B.; Alger, James S.; Cummings, Michelle R.; Princing, Jennifer; Lee, Yeong; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films
Alves Donaton, Ricardo; Iacopi, Francesca; Baklanov, Mikhaïl; Shamiryan, Denis; Coenegrachts, Bart; Struyf, Herbert; Lepage, Muriel; Meuris, Marc; Van Hove, Marleen; Gray, William; Meynen, Herman; De Roest, David; Vanhaelemeersch, Serge; Maex, Karen (2000) -
Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Gray, William; Loboda, M.; Struyf, Herbert; Van Hove, Marleen; Donaton, R. A.; Sleeckx, Erik; Stucchi, Michele; Gao, Teng; Boullart, Werner; Coenegrachts, Bart; Maenhoudt, Mireille; Vanhaelemeersch, Serge; Meynen, Herman; Maex, Karen (2000)