Browsing by author "Daily, Robert"
Now showing items 1-20 of 22
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3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
Daily, Robert; Capuz, Giovanni; Wang, Teng; Bex, Pieter; Struyf, Herbert; Sleeckx, Erik; Demeurisse, Caroline; Attard, A.; Eberharter, W.; Klingler, H. (2015) -
3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges
De Vos, Joeri; Cherman, Vladimir; Detalle, Mikael; Wang, Teng; Salahouelhadj, Abdellah; Daily, Robert; Van der Plas, Geert; Beyne, Eric (2014) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2013) -
Development and evaluation of photodefinable wafer level underfill
Mitsukura, Kazuyuki; Saisyo, Ryouta; Makino, Tatsuya; Hatakeyama, Keiichi; Minegishi, Tomonori; Wang, Teng; Daily, Robert; Duval, Fabrice; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2015) -
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Effects of packaging on mechanical stress in 3D-ICs
Cherman, Vladimir; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Van der Plas, Geert; De Vos, Joeri; Wang, Teng; Daily, Robert; Salahouelhadj, Abdellah; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2015) -
Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Maggioni, Federica; De Vos, Joeri; Wang, Teng; Daily, Robert; Beyne, Eric (2015-05) -
Exploring process interaction of no-flow underfill and thermo-compression bonding in D2D stacking
Capuz, Giovanni; Daily, Robert; Wang, Teng; Struyf, Herbert; Miller, Andy; Rebibis, Kenneth June (2013) -
Fabrication of silicon based microfluidics device for cell sorting applications
Majeed, Bivragh; Liu, Chengxun; Van Acker, Lut; Daily, Robert; Miyazaki, Tomokazu; Sabuncuoglu Tezcan, Deniz; Lagae, Liesbet (2014) -
Integration of capillary self-alignment for Face to Face micro bump bonding
Pham, Nga; Daily, Robert; Armini, Silvia; Delande, Tinne; Pantouvaki, Marianna; Soussan, Philippe (2013-09) -
Interposer technology for high band width interconnect applications
Detalle, Mikael; La Manna, Antonio; De Vos, Joeri; Nolmans, Philip; Daily, Robert; Beyer, Gerald; Beyne, Eric (2013) -
NiB Capping of Cu landing pads for thermocompression bonding
England, Luke; Dictus, Dries; De Vos, Joeri; Conard, Thierry; Daily, Robert; Marinissen, Erik Jan (2014) -
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014) -
Process development to enable die sorting and 3D IC stacking
La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Stacking aspects in the view of scaling
De Vos, Joeri; La Manna, Antonio; Daily, Robert; Rebibis, Kenneth June; Beyne, Eric (2012) -
Underfill material screening and process characterization for 3D stacking
Rebibis, Kenneth June; La Manna, Antonio; Gerets, Carine; Beyne, Eric; Daily, Robert; Capuz, Giovanni (2012)