Browsing by author "Richard, Emmanuel"

A grain size limitation inherent to electroplated copper films

Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan; Maex, Karen (2000)

Advanced solutions for copper and low k technology

Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000)

Critical issues in the integration of Copper and low-k dielectrics

Donaton, R. A.; Coenegrachts, Bart; Maex, Karen; Struyf, Herbert; Vanhaelemeersch, Serge; Beyer, Gerald; Richard, Emmanuel; Vervoort, Iwan; Fyen, Wim; Grillaert, Joost; van der Groen, Sonja; Stucchi, Michele; De Roest, David (1999)

Integration of electroless and electrolytic Cu and IC back end of line technologies

Maex, Karen; Brongersma, Sywert; Lantasov, Yuri; Richard, Emmanuel; Palmans, Roger; Vervoort, Iwan (2000)

Integration of electroless and electrolytic Cu in the IC back end line of technologies

Maex, Karen; Palmans, Roger; Lantasov, Yuri; Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan (1999)

Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures

Donaton, R. A.; Coenegrachts, Bart; Maenhoudt, Mireille; Pollentier, Ivan; Struyf, Herbert; Vanhaelemeersch, Serge; Grillaert, Joost; Fyen, Wim; Beyer, Gerald; Stucchi, Michele; Richard, Emmanuel; Vervoort, Iwan; De Roest, David; Maex, Karen (2000)

Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper

Brongersma, Sywert; Vervoort, Iwan; Judelewicz, Moshe; Bender, Hugo; Conard, Thierry; Vandervorst, Wilfried; Beyer, Gerald; Richard, Emmanuel; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999)

Rapid thermal anealing of electro chemically plated Cu films

Beyer, Gerald; Kitabijan, P.; Brongersma, Sywert; Proost, Joris; Bender, Hugo; Richard, Emmanuel; Vervoort, Iwan; Hey, P.; Zhang, P.; Maex, Karen (2000)

Rapid thermal annealing of electro chemically plated Cu films

Beyer, Gerald; Kitabijan, P.; Brongersma, Sywert; Bender, Hugo; Richard, Emmanuel; Vervoort, Iwan; Hey, P.; Zhang, P.; Maex, Karen (1999)

Roles of additive during filling process of damascene structures with electrochemical deposited copper

Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Beyer, Gerald; Bender, Hugo; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999)

Roles of additives during filling process of damascene structures with electrochemical deposited copper

Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Bender, Hugo; Beyer, Gerald; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (2000)

Self-annealing characterization of electroplated copper films

Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (1999)

Self-annealing characterization of electroplated copper films

Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (2000)

Stress and impurities in electroplated copper

Brongersma, Sywert; Kerr, Emma; Vervoort, Iwan; Richard, Emmanuel; Maex, Karen (2001)

Stress in electrochemically deposited copper

Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan; Maex, Karen (1999)

Two-step room temperature grain growth in electroplated copper

Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan; Bender, Hugo; Vandervorst, Wilfried; Lagrange, Sébastien; Beyer, Gerald; Maex, Karen (1999)