Browsing by author "Verlinden, Bert"
Now showing items 1-20 of 21
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A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Lambrinou, Konstantza; Maurissen, Wout; Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; De Wolf, Ingrid (2009) -
A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Ratchev, Petar; Loccufier, Tony; Vandevelde, Bart; Verlinden, Bert; Teliszewski, Steven; Werkhoven, Daniel; Allaert, Bart (2005) -
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2009) -
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2005-09) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures
Yang, Yu; Bender, Hugo; Arstila, Kai; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid (2008) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder
Ratchev, Petar; Vandevelde, Bart; Verlinden, Bert (2005-10) -
Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy
Okoro, Chukwudi; Yang, Yu; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk; Verlinden, Bert; De Wolf, Ingrid (2008) -
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2011) -
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Okoro, Chukwudi; Vanstreels, Kris; Labie, Riet; Luhn, Ole; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2010) -
Influence of intermetallic properties of lead-free flip chip solder joints
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Vandepitte, Dirk; Verlinden, Bert (2008) -
Influence of the processing method on the amount and development of voids in miniaturized interconnections
Dimcic, Biljana; Labie, Riet; Zhang, Wenqi; De Wolf, Ingrid; Verlinden, Bert (2010) -
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2005) -
Low-temperature enbrittlement of lead-free solders in joint level impact testing
Limaye, Paresh; Maurissen, Wout; Lambrinou, Konstantza; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Hillaert, Joost; Vandepitte, Dirk; Verlinden, Bert (2007-12) -
Phase formation in Cu/Ni/Sn thin film system
Dimcic, Biljana; De Messemaeker, Joke; Zhang, Wenqi; Croes, Kristof; Vanstreels, Kris; Verlinden, Bert; De Wolf, Ingrid (2012) -
Process induced sub-surface damage in mechanically ground silicon wafers
Yang, Yu; De Munck, Koen; Cotrin Teixeira, Ricardo; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid (2008-07) -
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
Yang, Yu; Labie, Riet; Ling, Fangzhou; Zhao, Chao; Radisic, Alex; Van Olmen, Jan; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid (2010) -
Statistical analysis of the influence of thinning processes on the strength of silicon
Yang, Yu; Cotrin Teixeira, Ricardo; Roussel, Philippe; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid (2009) -
Study of the mechanism of bulk embrittlement of Sn-based Pb-free solders
Lambrinou, Konstantza; Vandevelde, Bart; Verlinden, Bert (2008)