Browsing by author "Sleeckx, Erik"
Now showing items 41-60 of 79
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Highly efficient grating coupler between optical fiber and silicon photonic crcuit
Selvaraja, Shankar; Vermeulen, Diedrik; Schaekers, Marc; Sleeckx, Erik; Bogaerts, Wim; Dumon, Pieter; Van Thourhout, Dries; Baets, Roel (2009) -
Impact of LKD5109 low-k to cap/liner interfaces in single damascene process and performance
Iacopi, Francesca; Patz, Michael; Vos, Ingrid; Tokei, Zsolt; Sijmus, Bram; Le, Quoc Toan; Sleeckx, Erik; Eyckens, Brenda; Struyf, Herbert; Das, Arabinda; Maex, Karen (2003) -
Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding
Duval, Fabrice; Wang, Teng; Bex, Pieter; Lofrano, Melina; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric; Gerets, Carine (2017) -
Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
In-line and nondestructive analysis of selectively grown epitaxial Si1-xGex and Si/Si1-xGex layers by spectroscopic ellipsometry and comparison with other established techniques
Loo, Roger; Sleeckx, Erik; Caymax, Matty; Blavier, G.; Kremer, Stephanie (2001) -
Influence of composition of SiCN as interfacial layer on plasma activated direct bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Influence of composition of SiCN for surface activated bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyne, Eric (2018) -
Influence of Si wafer thinning processes on (Sub)surface defects
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric; Uedono, Akira (2017) -
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef (2010) -
Integration feasibility of porous SiLK semiconductor dielectric
Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Castillo, D. W.; Lucero, S.; Caluwaerts, Rudy; Alaerts, Carine; Mannaert, Geert; Boullart, Werner; Sleeckx, Erik; Schaekers, Marc; Tokei, Zsolt; Vervoort, Iwan; Steenbergen, Johnny; Sijmus, Bram; Vos, I.; Meuris, Marc; Iacopi, Francesca; Donaton, R (2001) -
Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)
Siew, Yong Kong; Versluijs, Janko; Kunnen, Eddy; Ciofi, Ivan; Alaerts, Wilfried; Dekkers, Harold; Volders, Henny; Suhard, Samuel; Cockburn, Andrew; Sleeckx, Erik; Van Besien, Els; Struyf, Herbert; Maenhoudt, Mireille; Noori, Atif; Padhi, Deenesh; Shah, Kavita; Gravey, Virginie; Beyer, Gerald (2010) -
Large-area high-efficiency n-type Si rear junction cells featuring laser ablation and Cu-plated front contacts
Aleman, Monica; Tous, Loic; Cornagliotti, Emanuele; Duerinckx, Filip; John, Joachim; Posthuma, Niels; Russell, Richard; Singh, Sukhvinder; Sleeckx, Erik; Uruena De Castro, Angel; Szlufcik, Jozef (2013) -
Low loss amorphous silicon photonic wire and ring resonator fabricated by CMOS process
Selvaraja, Shankar; Sleeckx, Erik; Bogaerts, Wim; Schaekers, Marc; Dumon, Pieter; Van Thourhout, Dries; Baets, Roel (2007-09) -
Low-loss amorphous sSilicon-on-iInsulator technology for photonic integrated circuitry
Selvaraja, Shankar; Sleeckx, Erik; Schaekers, Marc; Bogaerts, Wim; Van Thourhout, Dries; Dumon, Pieter; Baets, Roel (2009) -
Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Numerically optimized double layer antireflective coating for high Efficiency interdigitated back contact (IBC) silicon solar cells
Zielinski, Bartosz; Florakis, Antonios; O'Sullivan, Barry; Sleeckx, Erik; Posthuma, Niels; Aleman, Monica; Singh, Sukhvinder; Debucquoy, Maarten; Alajmi, Fahed; Mertens, Robert; Poortmans, Jef (2014) -
On the scalability of source/drain current enhancement in thin film sSOI
Augendre, Emmanuel; Eneman, Geert; De Keersgieter, An; Simons, Veerle; De Wolf, Ingrid; Ramos, Javier; Brus, Stephan; Pawlak, Bartek; Severi, Simone; Leys, Frederik; Sleeckx, Erik; Locorotondo, Sabrina; Ercken, Monique; de Marneffe, Jean-Francois; Fei, Lu; Seacrist, Mike; Kellerman, Bruce; Goodwin, Michael; Jurczak, Gosia; Biesemans, Serge (2005) -
Optimisation of active area edge protection in shallow trench isolation
Augendre, Emmanuel; Rooyackers, Rita; Pochet, Sandrine; Grau, Lluis; Sleeckx, Erik; Vandamme, Ewout; Badenes, Gonçal (2001) -
Optimization of low-temperature silicon nitride processes for improvement of device performance
Sleeckx, Erik; Schaekers, Marc; Shi, Xiaoping; Kunnen, Eddy; Degroote, Bart; Jurczak, Gosia; de Potter de ten Broeck, Muriel; Augendre, Emmanuel (2005) -
Optimization of low-tempurature silicon nitride processes for improvement of device performance
Sleeckx, Erik; Schaekers, Marc; Shi, Xiaoping; Kunnen, Eddy; Degroote, Bart; Jurczak, Gosia; de Potter de ten Broeck, Muriel; Augendre, Emmanuel (2004)