Browsing by author "Sleeckx, Erik"
Now showing items 21-40 of 79
-
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
Cost effective dry oxidation for emitter passivation: a key step for high efficiency screen printed p-type PERC solar cells
Choulat, Patrick; Prajapati, Victor; Sleeckx, Erik; Singh, Sukhvinder; Tous, Loic; O'Sullivan, Barry; Ferro, V.; Duerinckx, Filip (2013) -
Defect identification in bonding surface layer by positron annihilation spectroscopy
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Nagano, Fuya; Sleeckx, Erik; Beyer, Gerald; Uedono, Akira; Beyne, Eric (2019) -
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, Mitsuru; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2015) -
Deposited silicon-on-insulation material technology for photonic integrated circuitry
Selvaraja, Shankar; Bogaerts, Wim; Van Thourhout, Dries; Baets, Roel; Sleeckx, Erik; Schaekers, Marc (2007-12) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Direct bonding of low temperature heterogeneous dielectrics
Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming for wafer-to-wafer 3D integration
Inoue, Fumihiro; Visker, Jakob; Jourdain, Anne; Moeller, Berthold; Yokoyama, Kaori; Peng, Lan; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Edge trimming induced defects on direct bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2018) -
Effect of dopants on the dissolution behavior of silicon substrates in HF-based cleaning solutions
Abu Jeriban, Salima; Guiot, Y.; Bacherius, L.; Proost, J.; Sleeckx, Erik; Vos, Rita; Mertens, Paul (2008) -
Electrical characterization of silicon-rich-oxide-based memory cells using pulsed current-voltage techniques
Rosmeulen, Maarten; Sleeckx, Erik; De Meyer, Kristin (2002) -
Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019) -
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Bertheau, Julien; Inoue, Fumihiro; Phommahaxay, Alain; Peng, Lan; Iacovo, Serena; Rassoul, Nouredine; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Nakamura, Atsushi (2018) -
Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
Phommahaxay, Alain; Potoms, Goedele; Verbinnen, Greet; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Donghun, Bai; Xiao, Liu; Yess, Kim; Arnold, Kim; Spiess, Walter; Griesbach, Tim; Rapps, Thomas; Lutter, Stefan (2016) -
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2020) -
Ge deep sub-micron pFETs with etched TaN metal gate on a High-K dielectric, fabricated in a 200mm silicon prototyping line
De Jaeger, Brice; Houssa, Michel; Satta, Alessandra; Kubicek, Stefan; Verheyen, Peter; Van Steenbergen, Jan; Croon, Jeroen; Kaczer, Ben; Van Elshocht, Sven; Delabie, Annelies; Kunnen, Eddy; Sleeckx, Erik; Teerlinck, Ivo; Lindsay, Richard; Schram, Tom; Chiarella, Thomas; Degraeve, Robin; Conard, Thierry; Poortmans, Jef; Winderickx, Gillis; Boullart, Werner; Schaekers, Marc; Mertens, Paul; Caymax, Matty; Vandervorst, Wilfried; Van Moorhem, Els; Biesemans, Serge; De Meyer, Kristin; Ragnarsson, Lars-Ake; Lee, S.; Kota, G.; Raskin, G.; Mijlemans, P.; Autran, J.L.; Afanas'ev, V.; Stesmans, A.; Meuris, Marc; Heyns, Marc (2004) -
Germanium deep-sub micron PMOS transistors with etched TaN metal gate on a high-k dielectric, fabricated in a 200mm prototyping line
Meuris, Marc; De Jaeger, Brice; Kubicek, Stefan; Verheyen, Peter; Van Steenbergen, Jan; Lujan, Guilherme; Kunnen, Eddy; Sleeckx, Erik; Teerlinck, I; Van Elshocht, Sven; Delabie, Annelies; Lindsay, Richard; Satta, Alessandra; Schram, Tom; Chiarella, Thomas; Degraeve, Robin; Richard, Olivier; Conard, Thierry; Poortmans, Jef; Winderickx, Gillis; Houssa, Michel; Boullart, Werner; Schaekers, Marc; Mertens, Paul; Caymax, Matty; De Gendt, Stefan; Vandervorst, Wilfried; Van Moorhem, Els; Biesemans, Serge; De Meyer, Kristin; Ragnarsson, Lars-Ake; Lee, S.; Kota, G.; Raskin, G.; Mijlemans, P.; Afanasiev, Valeri; Stesmans, Andre; Heyns, Marc (2004) -
High-k gate stack engineering – towards meeting low standby power and high performance targets
De Gendt, Stefan; Brunco, David; Caymax, Matty; Conard, Thierry; Date, Lucien; Delabie, Annelies; Deweerd, Wim; Groeseneken, Guido; Houssa, Michel; Hyun, Sangjin; Kaushik, Vidya; Kubicek, Stefan; Maes, Jan; Pantisano, Luigi; Ragnarsson, Lars-Ake; Rohr, Erika; Schram, Tom; Shimamoto, Y.; Sleeckx, Erik; Vandervorst, Wilfried; Van Elshocht, Sven; Yamada, Naoki; Witters, Thomas; Zhao, Chao; Zimmerman, Paul; Heyns, Marc (2005)