Browsing by author "Bertheau, Julien"
Now showing items 1-13 of 13
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Advances in temporary carrier technology for high density fan-out device build-up
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019) -
Development of compression molding process for Fan-Out wafer level packaging
Bertheau, Julien; Duval, Fabrice; Kubota, Tadashi; Bex, Pieter; Kennes, Koen; Phommahaxay, Alain; Podpod, Arnita; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric (2017) -
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Bertheau, Julien; Inoue, Fumihiro; Phommahaxay, Alain; Peng, Lan; Iacovo, Serena; Rassoul, Nouredine; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Nakamura, Atsushi (2018) -
Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Protective layer for collective die to wafer hybrid bonding
Inoue, Fumihiro; Bertheau, Julien; Suhard, Samuel; Phommahaxay, Alain; Ohashi, Takuya; Kinoshita, Tetsuro; Kinoshita, Yohei; Beyne, Eric (2019) -
Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
Kwak, Ji-Youn; Chery, Emmanuel; Bertheau, Julien; Slabbekoorn, John; De Messemaeker, Joke; Beyne, Eric (2023) -
TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O
Guermandi, Davide; Bogaerts, Lieve; Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Bex, Pieter; De Coster, Jeroen; He, Junwen; Phommahaxay, Alain; Balakrishnan, Sadhishkumar; Demeurisse, Caroline; Bertheau, Julien; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Srinivasan, Ashwyn; Van Huylenbroeck, Stefaan; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2019) -
Ultra-low warpage epoxy mold compound for fan-out wafer level package applications
Duval, Fabrice; Podpod, Arnita; Salahouelhadj, Abdellah; Phommahaxay, Alain; Bertheau, Julien; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric (2018)