Browsing by author "van der Veen, Marleen"
Now showing items 21-40 of 120
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Chemical mechanical polishing of manganese (Mn)-based barrier films in the BEOL interconnects for advanced metallization nodes
Sagi, Kaushik; Babu, S.V.; van der Veen, Marleen; Struyf, Herbert; Teugels, Lieve (2016) -
CMOS area scaling and the need for high aspect ratio vias
Briggs, Basoene; Guissi, Sofiane; Wilson, Chris; Ryckaert, Julien; Paolillo, Sara; Vandersmissen, Kevin; Versluijs, Janko; Lorant, Christophe; Heylen, Nancy; Boemmels, Juergen; Tokei, Zsolt; Sherazi, Yasser; Weckx, Pieter; Kljucar, Luka; van der Veen, Marleen; Boccardi, Guillaume; De Heyn, Vincent; Gupta, Anshul; Ervin, Joseph; Kamon, Matt (2018) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies
van der Veen, Marleen; Vandersmissen, Kevin; Dictus, Dries; Demuynck, Steven; Liu, Ran; Bin, Xiaomin; Nalla, Praveen; Lesniewska, Alicja; Hall, Laurie; Croes, Kristof; Zhao, Larry; Boemmels, Juergen; Kolics, Artur; Tokei, Zsolt (2015) -
Cobalt pre-metallization clean and functional water rinse in BEOL interconnect
Kesters, Els; Le, Quoc Toan; van der Veen, Marleen; Akanishi, Yuya; Hideaki, Iino; Mizutani, Atsushi; Holsteyns, Frank (2019) -
Complementary metal-oxide-semiconductor-compatible and self-aligned catalyst formation for carbon nanotube synthesis and interconnect fabrication
Zhang, Can; Feng, Yan; Bayer, Bernhard; Blume, Raoul; van der Veen, Marleen; Xie, Rongsi; Zhong, Guofang; Chen, Bingan; Knop-Gericke, Axel; Schlögl, Robert; Capraro, Bernard; Hofmann, Stephan; Robertson, john (2012) -
Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects
van der Veen, Marleen; Inoue, Fumihiro; Vandersmissen, Kevin; Dictus, Dries; Tanaka, Tetsu; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2016) -
Cu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections
Jourdan, Nicolas; Varela Pedreira, Olalla; van der Veen, Marleen; Adelmann, Christoph; Van Elshocht, Sven; Tokei, Zsolt (2018) -
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Vandersmissen, Kevin; Van Huylenbroeck, Stefaan; Struyf, Herbert; Tanaka, Tetsu (2014) -
CVD based selective Co deposition on Cu and W for via pre-fill
Chen, Phil; Zheng, Jun-Fei; Lieten, Ruben; Frye, Asa; Baum, Thomas; O'Neill, James; van der Veen, Marleen; Murdoch, Gayle; Boemmels, Juergen; Tokei, Zsolt; Xu, Jeff; Zhu, John; Bao, Jerry; Badaroglu, Mustafa; Yeap, Geoffrey (2016) -
CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/low-k interconnects
Jourdan, Nicolas; van der Veen, Marleen; Vega Gonzalez, Victor; Croes, Kristof; Lesniewska, Alicja; Varela Pedreira, Olalla; Van Elshocht, Sven; Boemmels, Juergen; Tokei, Zsolt (2016) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Defect characterization in templated DSA through electrical measurements
Rincon Delgadillo, Paulina; Chan, BT; Gronheid, Roel; van der Veen, Marleen; Heylen, Nancy; Vandersmissen, Kevin; Demuynck, Steven; Boemmels, Juergen (2016) -
Demonstration of a cost effective Cu electroless TSV metallization scheme
Vandersmissen, Kevin; Inoue, Fumihiro; Velenis, Dimitrios; Li, Yunlong; Dictus, Dries; Frees, Bart; Van Huylenbroeck, Stefaan; Kondo, M.; Seino, T.; Heylen, Nancy; Struyf, Herbert; van der Veen, Marleen (2015) -
Development of a new metallization scheme for making nanoscale interconnects based on plasma-functionalization and electroless deposition
Dictus, Dries; Dordi, Y.; Gurer, E.; Krishtab, Mikhail; Baklanov, Mikhaïl; Carbonell, Laure; van der Veen, Marleen; El-Mekki, Zaid; Tokei, Zsolt (2013) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu; Shingubara, Shoso (2014) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
Doped GeSe materials for selector applications
Avasarala, Naga Sruti; Govoreanu, Bogdan; Opsomer, Karl; Devulder, Wouter; Clima, Sergiu; Detavernier, Christophe; van der Veen, Marleen; Van Houdt, Jan; Heyns, Marc; Goux, Ludovic; Kar, Gouri Sankar (2017) -
Dual role of hydrogen in low temperature plasma enhanced carbon nanotube growth
Vanpaemel, Johannes; van der Veen, Marleen; Cott, Daire; Sugiura, Masahito; Asselberghs, Inge; De Gendt, Stefan; Vereecken, Philippe (2015)