Browsing by author "Gonzalez, Mario"
Now showing items 21-40 of 208
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Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2023) -
B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages
Cowley, A.; Ivankovic, A.; Wong, C.S; Bennett, N.S.; Danilewsky, A.N.; Gonzalez, Mario; Cherman, Vladimir; Vandevelde, Bart; De Wolf, Ingrid; McNally, P.J. (2016) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Bleifreies Löten und FEM-Modellierung
Snoeckx, Koen; Gonzalez, Mario (2005-10) -
Bump pad design and its impact on the reliability of flip chip packages
Gonzalez, Mario; Lofrano, Melina; Vanstreels, Kris; Zahedmanesh, Houman; Beyne, Eric (2018) -
Challenges and solutions for chip package interaction
Vanstreels, Kris; Cherman, Vladimir; Zahedmanesh, Houman; De Wolf, Ingrid; Gonzalez, Mario (2015) -
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Channel hot-carrier degradation on strained MOSFETs with embedded SiGe or SiC source/drain
Amat, E.; Rodriguez, R.; Gonzalez, Mario; Martin-Martinez, J.; Nafria, M.; Aymerich, X.; Machkaoutsan, Vladimir; Bauer, M.; Verheyen, Peter; Simoen, Eddy (2010) -
Characterization and FE analysis on the shear test of electronic materials
Gonzalez, Mario; Vandevelde, Bart; Van Hoof, Rita; Beyne, Eric (2004-12) -
Characterization of Impact of Vertical Stress on FinFETs
Furuhashi, Takahisa; Haneda, Masaki; Sasaki, Toru; Kagawa, Yoshihisa; Ooka, Yutaka; Hirano, Tomoyuki; Ohno, Keiichi; Iwamoto, Hayato; Saito, Masaki; Liu, Yefan; Hiblot, Gaspard; Vanstreels, Kris; Gonzalez, Mario; Velenis, Dimitrios; Beyer, Gerald; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric (2019) -
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012) -
Chip package interaction: A stress analysis on 3D IC's packages
Lofrano, Melina; Gonzalez, Mario; Guo, Wei; Van der Plas, Geert (2015) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
CTE measurements for 3D package substrates using digital image correlation
Salahouelhadj, Abdellah; Gonzalez, Mario (2016) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Defect localization in 3-D TSV structures by differential light-induced capacitance alteration
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Delamination in BEOL: analysis of interface failure by combined experimental & modeling approaches
Debecker, Bjorn; Vanstreels, Kris; Gonzalez, Mario; Vandevelde, Bart (2013)