Browsing by author "Sprey, Hessel"
Now showing items 21-35 of 35
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Integration and dielectric reliability of 30nm 1/2 pitch structures in Aurora LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2009) -
Integration and dielectric reliability of 30nm ½ pitch structures in Aurora® LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2010) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H; Takamure, N; Beynet, Julien; Sprey, Hessel; Matsushita, K; Kobayashi, N; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H.; Takamure, N.; Beynet, Julien; Sprey, Hessel; Matsushita, K.; Kobayashi, N.; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008) -
Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)
Beynet, Julien; Wong, Patrick; Miller, Andy; Locorotondo, Sabrina; Vangoidsenhoven, Diziana; Yoon, Tae-Ho; Demand, Marc; Park, Hyung-Sang; Vandeweyer, Tom; Sprey, Hessel; Yoo, Yong-Min; Maenhoudt, Mireille (2009) -
Materials characterization of WNxCy, WNx and WCx films for advanced barriers
Volders, Henny; Tokei, Zsolt; Bender, Hugo; Brijs, Bert; Caluwaerts, Rudy; Carbonell, Laure; Conard, Thierry; Drijbooms, Chris; Franquet, Alexis; Garaud, Sylvain; Hoflijk, Ilse; Li, Wei-Min; Moussa, Alain; Sinapi, Fabrice; Sprey, Hessel; Travaly, Youssef; Vanhaeren, Danielle; Vereecke, Guy (2007) -
Nucleation and growth of TiN films deposited by atomic layer deposition
Satta, Alessandra; Brongersma, Sywert; Schuhmacher, Jörg; Conard, Thierry; Beyer, Gerald; Maex, Karen; Viitanen, M.M.; Brongersma, H.H.; Besling, W.; Kilpela, Olli; Sprey, Hessel; Vantomme, Andre (2002) -
Opportunities and challenges for integration of ALD barrier layers in damascene process flows
Sprey, Hessel; Schuhmacher, Jorg; Travaly, Youssef; Sutcliffe, Victor; Abell, Thomas; Bastings, Hans; Stokhof, Maarten; Haukka, Suvi; Li, Wei-Min; Beyer, Gerald; Raaijmakers, Ivo (2004) -
Sub 3 nm gate oxide growth and reliability
Depas, Michel; Heyns, Marc; Sprey, Hessel; Wilhelm, Rudi (1997) -
Thin film characterization of PEALD Ru layers on an ALD WNC substrate
Volders, Henny; Tokei, Zsolt; Sinapi, Fabrice; Bender, Hugo; Benedetti, Alessandro; Brijs, Bert; Conard, Thierry; Franquet, Alexis; Steenbergen, Johnny; Travaly, Youssef; Sprey, Hessel; Li, Wei-Min; Shimizu, Akira; Park, Hyung Sang (2007) -
Ultra-thin gate oxides below 3 nm grown in a cluster tool
Depas, Michel; Nigam, Tanya; Kenis, Karine; Heyns, Marc; Sprey, Hessel; Wilhelm, Rudi (1996) -
Use of MIR-FTIR and k-value measurements to assess potential solutions to reduce damage during porous low-k integration
Beynet, Julien; De Roest, David; Rochat, N.; Kellens, Kristof; Verdonck, Patrick; Sprey, Hessel (2009) -
Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route
De Roest, David; Travaly, Youssef; Beynet, J.; Sprey, Hessel; Labat, J.; Huffman, Craig; Verdonck, Patrick; Kaneko, S; Matsushita, K; Kobayashi, N; Beyer, Gerald (2010) -
Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
De Roest, David; Travaly, Youssef; Beynet, Julien; Sprey, Hessel; Labat, Julianne; Huffman, Craig; Verdonck, Patrick; Kaneko, S.; Matsushita, K.; Kobayashi, N.; Beyer, Gerald (2009)