Browsing by author "Heylen, Nancy"
Now showing items 21-40 of 152
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Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper
Wen, Liang Gong; Roussel, Philippe; Varela Pedreira, Olalla; Briggs, Basoene; Groven, Benjamin; Dutta, Shibesh; Popovici, Mihaela Ioana; Heylen, Nancy; Ciofi, Ivan; Vanstreels, Kris; Osterberg, Frederik; Hansen, Ole; Petersen, Dirch H.; Opsomer, Karl; Detavernie, Christophe; Wilson, Chris; Van Elshocht, Sven; Croes, Kristof; Bommels, Jurgen; Tokei, Zsolt; Adelmann, Christoph (2016-09) -
Barrier/liner stacks for scaling the Cu interconnect metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019) -
Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node
Gupta, Anshul; Tao, Zheng; Radisic, Dunja; Mertens, Hans; Varela Pedreira, Olalla; Demuynck, Steven; Boemmels, Juergen; Devriendt, Katia; Heylen, Nancy; Wang, Shouhua; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Peter, Antony; Rassoul, Nouredine; Siew, Yong Kong; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; Capogreco, Elena; Mannaert, Geert; Sepulveda Marquez, Alfonso; Dupuy, Emmanuel; Vandersmissen, Kevin; Chehab, Bilal; Murdoch, Gayle; Altamirano Sanchez, Efrain; Biesemans, Serge; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2022) -
Buried Power Rail Metal exploration towards the 1 nm Node
Gupta, Anshul; Radisic, Dunja; Maes, J.W.; Varela Pedreira, Olalla; Soulie, Jean-Philippe; Jourdan, Nicolas; Mertens, Hans; Bandyopadhyay, Sudip; Le, Quoc Toan; Pacco, Antoine; Heylen, Nancy; Vandersmissen, Kevin; Devriendt, Katia; Zhu, C.; Datta, S.; Sebaai, Farid; Wang, S.; Mousa, M.; Lee, J.; Geypen, Jef; De Wachter, Bart; Chehab, Bilal; Salahuddin, Shairfe Muhammad; Murdoch, Gayle; Biesemans, Serge; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond
Gupta, Anshul; Varela Pedreira, Olalla; Tao, Zheng; Mertens, Hans; Radisic, Dunja; Jourdan, Nicolas; Devriendt, Katia; Heylen, Nancy; Wang, Shouhua; Chehab, Bilal; Jang, Doyoung; Hellings, Geert; Sebaai, Farid; Lorant, Christophe; Teugels, Lieve; Peter, Antony; Chan, BT; Schleicher, Filip; Demonie, Ingrid; Marien, Philippe; Sepulveda Marquez, Alfonso; Richard, Olivier; Nagesh, Nishanth; Lesniewska, Alicja; Lazzarino, Frederic; Ryckaert, Julien; Morin, Pierre; Altamirano Sanchez, Efrain; Murdoch, Gayle; Boemmels, Juergen; Demuynck, Steven; Na, Myung Hee; Tokei, Zsolt; Biesemans, Serge; Dentoni Litta, Eugenio; Horiguchi, Naoto (2020) -
Characterization of slurry system and suppression of oxide erosion in aluminun CMP (chemical-mechanical planarization)
Zhong, L.; Yang, G.; Holland, K.; Grillaert, Joost; Devriendt, Katia; Heylen, Nancy; Meuris, Marc (2000) -
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
CMOS area scaling and the need for high aspect ratio vias
Briggs, Basoene; Guissi, Sofiane; Wilson, Chris; Ryckaert, Julien; Paolillo, Sara; Vandersmissen, Kevin; Versluijs, Janko; Lorant, Christophe; Heylen, Nancy; Boemmels, Juergen; Tokei, Zsolt; Sherazi, Yasser; Weckx, Pieter; Kljucar, Luka; van der Veen, Marleen; Boccardi, Guillaume; De Heyn, Vincent; Gupta, Anshul; Ervin, Joseph; Kamon, Matt (2018) -
CMP process steps for the fabrication of spin-transfer torque magnetic random access memory
Tsvetanova, Diana; Heylen, Nancy; Teugels, Lieve; Crotti, Davide; Donadio, Gabriele Luca; Kar, Gouri Sankar; Struyf, Herbert; Souriau, Laurent; Mertens, Sofie; Swerts, Johan; Couet, Sebastien; Lin, Tsann; Paraschiv, Vasile; Kim, Woojin; Rao, Siddharth (2016) -
CMP processing to enable 3D stacked IC integration
Vaes, Jan; Heylen, Nancy; Van Olmen, Jan; Huyghebaert, Cedric; Leunissen, Peter (2009) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Co/Ni based p-MTJ stack for sub-20nm high density stand alone and high performance embedded memory application
Kar, Gouri Sankar; Kim, Woojin; Tahmasebi, Taiebeh; Swerts, Johan; Mertens, Sofie; Heylen, Nancy; Min, Tai (2014) -
Cost comparison of different TSV implementation options
Velenis, Dimitrios; Van Huylenbroeck, Stefaan; Heylen, Nancy; Vandersmissen, Kevin; Jourdain, Anne; Miller, Andy; Beyne, Eric (2016) -
Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
de Marneffe, Jean-Francois; Zhang, Liping; Heyne, Markus; Krishtab, Mikhail; Goodyear, Andy; Cooke, Mike; Heylen, Nancy; Ciofi, Ivan; Wen, Liang Gong; Wilson, Chris; Rutigliani, Vito; Decoster, Stefan; Savage, Travis; Matsunaga, Koichi; Nafus, Kathleen; Boemmels, Juergen; Tokei, Zsolt; Baklanov, Mikhaïl (2014) -
Cu passivation for integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Cu resistivity scaling limits for 20 nm copper damascene lines
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2008) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2009) -
Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Li, Yunlong; Heylen, Nancy; Delande, Tinne; Kellens, Kristof; Ong, Patrick; Leunissen, Peter; Tarnowka, Alexandre; Eliyahu, Aviv (2009-03)