Browsing by author "Heylen, Nancy"
Now showing items 41-60 of 152
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Damage free integration of ultralow-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Defect characterization in templated DSA through electrical measurements
Rincon Delgadillo, Paulina; Chan, BT; Gronheid, Roel; van der Veen, Marleen; Heylen, Nancy; Vandersmissen, Kevin; Demuynck, Steven; Boemmels, Juergen (2016) -
Demonstration of a cost effective Cu electroless TSV metallization scheme
Vandersmissen, Kevin; Inoue, Fumihiro; Velenis, Dimitrios; Li, Yunlong; Dictus, Dries; Frees, Bart; Van Huylenbroeck, Stefaan; Kondo, M.; Seino, T.; Heylen, Nancy; Struyf, Herbert; van der Veen, Marleen (2015) -
Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology
Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; De Keersgieter, An; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Baudemprez, Bart; Vandeweyer, Tom; Van Roey, Frieda; Baerts, Christina; Goossens, Danny; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Dusa, Mircea; Romijn, Leon; Pigneret, Charles; van Dijk, Andre; Schreutelkamp, Rob; Cockburn, Andrew; Gravey, Virginie; Meiling, H.; Hultermans, B.; Lok, S.; Shah, K.; Rajagopalan, R.; Gelatos, J.; Richard, Olivier; Bender, Hugo; Vandenberghe, Geert; Beyer, Gerald; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2009-12) -
Development of a SEM based methodology for the detection of sub-surface voids in nano-interconnects
Carbonell, Laure; Caluwaerts, Rudy; Heylen, Nancy; Volders, Henny; Kellens, Kristof; Tokei, Zsolt; Takada, S; Ban, N; Ishimoto, T; Suzuki, N.; Umehara, S. (2012) -
Dielectric reliability of 50nm 1/2 pitch structures in Aurora® LK
Demuynck, Steven; Kim, Hongun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Beyer, Gerald (2008) -
Dielectric reliability of 50nm half pitch structures in Aurora® LK
Demuynck, Steven; Kim, Honggun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Verdonck, Patrick; Volders, Henny; Heylen, Nancy; Kellens, Kristof; De Roest, David; Sprey, Hessel; Beyer, Gerald (2009) -
Direct CMP of high porosity ultra low-k materials
Heylen, Nancy (2011) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; Demuynck, Steven; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Radisic, Alex; Heylen, Nancy; Beyer, Gerald; Leunissen, Peter; Vereecken, Philippe (2011-05) -
Effect of CMP slurry filtration on wafer defectivity
Devriendt, Katia; Meuris, Marc; Heylen, Nancy; Vrancken, Evi; Grillaert, Joost; Heyns, Marc; Ling, Zhi Ming (1998) -
Effective work function engineering for aggressively scaled planar and FinFET-based devices with high-k last replacement metal gate technology
Veloso, Anabela; Chew, Soon Aik; Higuchi, Yuichi; Ragnarsson, Lars-Ake; Simoen, Eddy; Schram, Tom; Witters, Thomas; Van Ammel, Annemie; Dekkers, Harold; Tielens, Hilde; Devriendt, Katia; Heylen, Nancy; Sebaai, Farid; Brus, Stephan; Favia, Paola; Geypen, Jef; Bender, Hugo; Phatak, Anup; Chen, M. S.; Lu, X.; Ganguli, S.; Lei, Y.; Tang, W.; Fu, X.; Gandikota, S.; Noori, A.; Brand, A.; Yoshida, N.; Thean, Aaron; Horiguchi, Naoto (2012-09) -
Effective work function engineering for aggressively scaled planar and multi-gate fin field-effect transistor-based devices with high-k last replacement metal gate technology
Veloso, Anabela; Chew, Soon Aik; Higuchi, Yuichi; Ragnarsson, Lars-Ake; Simoen, Eddy; Schram, Tom; Witters, Thomas; Van Ammel, Annemie; Dekkers, Harold; Tielens, Hilde; Devriendt, Katia; Heylen, Nancy; Sebaai, Farid; Brus, Stephan; Favia, Paola; Geypen, Jef; Bender, Hugo; Phatak, Anup; Chen, M. S.; Lu, X.; Ganguli, S.; Lei, Yu; Tang, W.; Fu, X.; Gandikota, S.; Noori, A.; Brand, A.; Yoshida, N.; Thean, Aaron; Horiguchi, Naoto (2013) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Electrochemical, physical, and electrical characterization of two clean solutions for Cu PCMP clean
Li, Yunlong; Heylen, Nancy; Daviot, Jerome; Reid, Chris; Leunissen, Peter (2010) -
Electrochemical, physical, and electrical characterization of two clean solutions for Cu PCMP clean
Li, Yunlong; Heylen, Nancy; Daviot, Jerome; Reid, Chris; Leunissen, Peter (2012-04) -
Electromigration study of ultra narrow copper lines in low-k dielectric
Croes, Kristof; Moon, Kwang Jin; Carbonell, Laure; Struyf, Herbert; Heylen, Nancy; Tokei, Zsolt; Beyer, Gerald (2007) -
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Evaluation of metallization options for advanced Cu interconnects application
Jourdan, Nicolas; Carbonell, Laure; Heylen, Nancy; Swerts, Johan; Armini, Silvia; Maestre Caro, Arantxa; Demuynck, Steven; Croes, Kristof; Beyer, Gerald; Tokei, Zsolt; Van Elshocht, Sven; Vancoille, Eric (2011) -
Exploring W-Cu hybrid dual damascene metallization for future nodes
Lei, W.; Pethe, S.; Hwang, S.; Chen, F.; Wu, Z.; Machillot, J.; Cockburn, A.; Jansen, A.; van der Veen, Marleen; Varela Pedreira, Olalla; Heylen, Nancy; Jourdan, Nicolas; Lariviere, Stephane; Park, Seongho; Struyf, Herbert; Tokei, Zsolt (2021)