Browsing by author "Claes, Martine"
Now showing items 21-40 of 119
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Chemical and structural modifications in a 193-nm photoresist after low-k dry etch
Kesters, Els; Claes, Martine; Le, Quoc Toan; Lux, Marcel; Franquet, Alexis; Vereecke, Guy; Mertens, Paul; Frank, Martin M.; Carleer, Robert; Adriaensens, Peter; Biebuyck, J.J.; Bebelman, Sabine (2008) -
Cleaning and strip requirement for metal gate based CMOS integration
Schram, Tom; Sebaai, Farid; Claes, Martine; Vos, Rita; Wada, Masayuli; Rohr, Erika; Kubicek, Stefan (2009) -
Cleaning and strip requirements for metal gate based CMOS integration
Schram, Tom; Sebaai, Farid; Claes, Martine; Vos, Rita; Wada, Masayuki; Albert, Johan; Rohr, Erika; Kubicek, Stefan (2009) -
Cleaning of post-etch photoresist layer on patterned surface using organic solvent combined with physical forces
Le, Quoc Toan; Chiodarelli, Nicolo; Blum, Ivan; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy; Mertens, Paul (2007-04) -
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010) -
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
Compatibility of polysilicon with HfO2-based gate dielectrics for CMOS applications
Kaushik, V.; De Gendt, Stefan; Caymax, Matty; Young, E.; Röhr, Erika; Van Elshocht, Sven; Delabie, Annelies; Claes, Martine; Shi, Xiaoping; Chen, Jerry; Carter, Richard; Conard, Thierry; Vandervorst, Wilfried; Schaekers, Marc; Heyns, Marc (2003) -
Determination of photoresist degradation products in O-3/DI processing
Vankerckhoven, H.; De Smedt, F.; Van Herp, B.; Claes, Martine; De Gendt, Stefan; Heyns, Marc; Vinckier, Chris (2002) -
Determination of photoresist degradation products in O3/DI water processing
Vankerckhoven, Hans; De Smedt, Frank; Van Herp, Bart; Claes, Martine; De Gendt, Stefan; Heyns, Marc; Vinckier, Chris (2001) -
Development of a dielectric CMP process for replacement gate applications
Devriendt, Katia; Ong, Patrick; Kellens, Kristof; Veloso, Anabela; Crabbe, Yvo; Brus, Stephan; Claes, Martine; Leunissen, Peter (2010) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Development of integrated wet cleans for 3D-SIC technologies
Suhard, Samuel; Simms, Ihsan; Brown, Ian; Shogo, Mizota; Koji, Kagawa; Claes, Martine; Buisson, Thibault; Jourdain, Anne; Beyer, Gerald; De Gendt, Stefan (2013) -
Dielectric reliability of 50nm 1/2 pitch structures in Aurora® LK
Demuynck, Steven; Kim, Hongun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Beyer, Gerald (2008) -
Dielectric reliability of 50nm half pitch structures in Aurora® LK
Demuynck, Steven; Kim, Honggun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Verdonck, Patrick; Volders, Henny; Heylen, Nancy; Kellens, Kristof; De Roest, David; Sprey, Hessel; Beyer, Gerald (2009) -
Dummy oxide removal in high-K last process integration how to avoid silicon corrosion issue
Sebaai, Farid; Veloso, Anabela; Takahashi,; Pacco, Antoine; Claes, Martine; Schaekers, Marc; De Gendt, Stefan; Mertens, Paul; Struyf, Herbert (2013) -
Effect of additives on the removal efficiency of photoresist by ozone/Di-water processes; experimental study
Vankerckhoven, H.; De Smedt, Frank; Claes, Martine; De Gendt, Stefan; Heyns, Marc; Vinckier, Chris (2003) -
Effect of postdeposition anneal conditions on defect density of HfO2 layers measured by wet etching
Claes, Martine; De Gendt, Stefan; Witters, Thomas; Kaushik, Vidya; Conard, Thierry; Zhao, Chao; Manabe, Y.; Delabie, Annelies; Röhr, Erika; Chen, Jerry; Tsai, Wilman; Heyns, Marc (2004) -
Effects of interactions between HfO2 and poly-Si on MOSCAP and MESFET electrical behaviour
Kaushik, Vidya; Röhr, Erika; De Gendt, Stefan; Delabie, Annelies; Van Elshocht, Sven; Claes, Martine; Shimamoto, Yasuhiro; Ragnarsson, Lars-Ake; Witters, Thomas; Manabe, Y.; Heyns, Marc (2003) -
Electrical and physical characterization of MOSFETs with MBE grown La2HfO7 and HfO2 high-k dielectrics integrated in a conventional flow
Conard, Thierry; Pantisano, Luigi; Claes, Martine; Demand, Marc; Deweerd, Wim; De Gendt, Stefan; Houssa, Michel; Lujan, Guilherme; Ragnarsson, Lars-Ake; Rohr, Erika; Schram, Tom; Hooker, Jacob; Rittersma, Chris; Fompeyrinne, J.; Loquet, J.P. (2005)