Browsing by author "De Vos, Joeri"
Now showing items 41-60 of 105
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Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne; Schleicher, Filip; De Vos, Joeri; Stucchi, Michele; Chery, Emmanuel; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Walsby, Edward; Roberts, Kerry; Ashraf, Huma; Thomas, Dave; Beyne, Eric (2020) -
Extreme wafer thinning optimization for via-last applications
Jourdain, Anne; De Vos, Joeri; Inoue, Fumihiro; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Hopkins, Janet; Ashraf, Huma; Thomas, Dave (2016) -
First demonstration of hybrid CMOS imagers with simultaneous very low crosstalk and high-broadband quantum efficiency
Minoglou, Kiki; De Munck, Koen; De Vos, Joeri; Sabuncuoglu Tezcan, Deniz; Van Hoof, Chris; De Moor, Piet (2012) -
High density 20μm pitch CuSn microbump process for high-end 3D applications
De Vos, Joeri; Jourdain, Anne; Erismis, Mehmet Akif; Zhang, Wenqi; De Munck, Koen; La Manna, Antonio; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2011) -
High voltage CdSe-Ge TFT driver circuits for passive AC-TFEL displays
De Vos, Joeri; De Smet, Herbert; De Cubber, A.; Van Calster, Andre (1999) -
High voltage EL drivers integrated on glass
De Vos, Joeri; De Smet, Herbert; Van Calster, Andre (1997) -
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Roda Neve, Cesar; Detalle, Mikael; Nolmans, Philip; Li, Yunlong; De Vos, Joeri; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2016) -
High-k materials for tunnel barrier engineering in future memory technologies
Blomme, Pieter; Govoreanu, Bogdan; Rosmeulen, Maarten; Akheyar, Amal; Haspeslagh, Luc; De Vos, Joeri; Lorenzini, Martino; Van Houdt, Jan; De Meyer, Kristin (2004-10) -
Higk-k materials for tunnel barrier engineering in floating-gate flash memories
Blomme, Pieter; Govoreanu, Bogdan; Rosmeulen, Maarten; Akheyar, Amal; Haspeslagh, Luc; De Vos, Joeri; Lorenzini, Martino; Van Houdt, Jan; De Meyer, Kristin (2005) -
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Heylen, Nancy; Peng, Lan; Jamieson, Geraldine; Tutunjyan, Nina; Sardo, Stefano; Miller, Andy; Beyne, Eric (2018) -
Hybrid backside illuminated CMOS image sensors possessing low crosstalk
Ramachandra Rao, Padmakumar; De Munck, Koen; Minoglou, Kiki; De Vos, Joeri; Sabuncuoglu Tezcan, Deniz; De Moor, Piet (2011) -
Hybrid backside illuminated CMOS imager for high-end applications
De Vos, Joeri; De Munck, Koen; Erismis, Mehmet Akif; Minoglou, Kiki; Ramachandra Rao, Padmakumar; Zhang, Wenqi; Sabuncuoglu Tezcan, Deniz; De Moor, Piet; Soussan, Philippe (2011) -
Hybrid backside illuminated CMOS imager for high-end applications
De Vos, Joeri; De Munck, Koen; Erismis, Mehmet Akif; Minoglou, Kiki; Ramachandra Rao, Padmakumar; Zhang, Wenqi; Sabuncuoglu Tezcan, Deniz; De Moor, Piet; Soussan, Philippe (2011) -
Impact of backside process on high aspect ratio via-middle Cu through silicon via reliability
Li, Yunlong; Van Huylenbroeck, Stefaan; De Vos, Joeri; Stucchi, Michele; Croes, Kristof; Beyer, Gerald; Beyne, Eric (2017-06) -
Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows
De Vos, Joeri; Stucchi, Michele; Jourdain, Anne; Beyne, Eric; Patel, Jash; Crook, Kath; Carruthers, Mark; Hopkins, Janet; Ashraf, Huma (2015) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Murdoch, Gayle; De Vos, Joeri; Boemmels, Juergen; Beyne, Eric; Tokei, Zsolt (2016) -
Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2016) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, G.; Stoerring, Moritz; Hiebert, S.; Cross, Andrew (2017) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, Gerard; Stoerring, Moritz; Hiebert, Stephen; Cross, Andrew (2019)