Browsing imec Publications by imec author "f7c060856060171ab0565fd41170658e4ab08723"
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3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12) -
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
Back-end, low-k dielectric compatible resist rework procedure
Reybrouck, Mario; Vangoidsenhoven, Diziana; Maenhoudt, Mireille; Van Aelst, Joke; Boullart, Werner (2002) -
Barrier process development for damascene integration of porous SiLK resin films
Tokei, Zsolt; Waeterloos, Joost; Iacopi, Francesca; Caluwaerts, Rudy; Struyf, Herbert; Van Aelst, Joke; Maex, Karen (2002) -
Challenges of clean/strip processing for Cu/LowK technology
Baklanov, Mikhaïl; Le, Quoc Toan; Kesters, Els; Iacopi, Francesca; Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
Das, Arabinda; Kokubo, Terukazu; Furukawa, Yukiko; Struyf, Herbert; Vos, Ingrid; Sijmus, Bram; Iacopi, Francesca; Van Aelst, Joke; Le, Quoc Toan; Carbonell, Laure; Brongersma, Sywert; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Sleeckx, Erik; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Rosseel, Erik; Van Hove, Marleen; Vanhaelemeersch, Serge; Shiota, A.; Maex, Karen (2002) -
Cu/LKD-5109 damascene integration demonstration using FF-02 low-k spin-on hard-mask and embedded etch-stop
Kokubo, Terukazu; Das, Arabinda; Furukawa, Yukiko; Vos, Ingrid; Iacopi, Francesca; Struyf, Herbert; Van Aelst, Joke; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Bender, Hugo; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Van Hove, Marleen; Vanhaelemeersch, Serge; Peterson, William; Shiota, A.; Maex, Karen (2002) -
Damascene integration feasability of porous SiLK resin films
Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Das, Arabinda; Caluwaerts, Rudy; Alaerts, Carine; Boullart, Werner; Tokei, Zsolt; Van Hove, Marleen; Maex, Karen (2002) -
High aspect ratio via etch development for Cu nails in 3-D-stacked ICs
Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge (2008) -
Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005) -
Influence of absorbed water components on SiOCH low-k reliability
Li, Yunlong; Ciofi, Ivan; Carbonell, Laure; Heylen, Nancy; Van Aelst, Joke; Baklanov, Mikhaïl; Groeseneken, Guido; Maex, Karen; Tokei, Zsolt (2008-08) -
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef (2010) -
Integration feasibility of porous SiLK semiconductor dielectric
Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Castillo, D. W.; Lucero, S.; Caluwaerts, Rudy; Alaerts, Carine; Mannaert, Geert; Boullart, Werner; Sleeckx, Erik; Schaekers, Marc; Tokei, Zsolt; Vervoort, Iwan; Steenbergen, Johnny; Sijmus, Bram; Vos, I.; Meuris, Marc; Iacopi, Francesca; Donaton, R (2001) -
Integration of single damascene 85/85nm/L/S copper trenches in black diamond using 193nm optical lithography with dipole illumination
Van Olmen, Jan; Wu, Wen; Van Hove, Marleen; Travaly, Youssef; Brongersma, Sywert; Eyckens, Brenda; Maenhoudt, Mireille; Van Aelst, Joke; Struyf, Herbert; Demuynck, Steven; Tokei, Zsolt; Vervoort, Iwan; Sijmus, Bram; Vos, Ingrid; Ciofi, Ivan; Stucchi, Michele; Maex, Karen; Iacopi, Francesca (2003) -
Integration of tall triple-gate devices with inserted TaxNy gate in a 0.274μm² 6T-SRAM cell and advanced CMOS logic circuits
Witters, Liesbeth; Collaert, Nadine; Nackaerts, Axel; Demand, Marc; Demuynck, Steven; Delvaux, Christie; Lauwers, Anne; Baerts, Christina; Beckx, Stephan; Boullart, Werner; Brus, Stephan; Degroote, Bart; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Ercken, Monique; Goodwin, Michael; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Leray, Philippe; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Willems, Patrick; Wouters, Johan M. D.; Jurczak, Gosia; Biesemans, Serge (2005) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008) -
Low damage etch approach of a new porous SiOC(H) Low-k dielectric
Van Aelst, Joke; Struyf, Herbert; Dupont, Tania; Hendrickx, Dirk; Travaly, Youssef; Boullart, Werner; Vanhaelemeersch, Serge (2005) -
Minimizing plasma damage of CVD low-k materials by tuning a two step etch sequence.
Van Aelst, Joke; Baklanov, Mikhaïl; Le, Quoc Toan; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge (2004) -
Photonics-CMOS 3D integration: copper through-silicon-via approach
Masood, Adil; Bogaerts, Wim; Van Olmen, Jan; Van Aelst, Joke; Van Thourhout, Dries; Sabuncuoglu Tezcan, Deniz (2009)