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Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS
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1993 since deposited on 2021-10-24
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Acq. date: 2026-10-04
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1993 since deposited on 2021-10-24
1last month
1last week
Acq. date: 2026-10-04
Citations