Browsing Conference contributions by imec author "247af4929b75543d804745c4cdcf40cb5bb1b30f"
Now showing items 1-20 of 63
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A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
Guo, Bin; Wen, Lianggong; Helin, Philippe; Claes, Gert; Verbist, Agnes; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; De Wolf, Ingrid; Shahar, Abdul Hadi; Li, Yunlong; Cui, Hushan; Lux, Marcel; Vereecke, Guy; Tilmans, Harrie; Haspeslagh, Luc; Decoutere, Stefaan; Osman, Haris; Puers, Bob; Severi, Simone; Witvrouw, Ann (2011) -
Active-lite interposer for 2.5 & 3D integration
Hellings, Geert; Scholz, Mirko; Detalle, Mikael; Velenis, Dimitrios; de Potter de ten Broeck, Muriel; Roda Neve, Cesar; Li, Yunlong; Van Huylenbroeck, Stefaan; Chen, Shih-Hung; Marinissen, Erik Jan; La Manna, Antonio; Van der Plas, Geert; Linten, Dimitri; Beyne, Eric; Thean, Aaron (2015) -
Advanced metallization scheme for 3×50μm via middle TSV and beyond
Van Huylenbroeck, Stefaan; Li, Yunlong; Heylen, Nancy; Croes, Kristof; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Gopinath, Sanjay; Nalla, Praveen; Thorum, Matthew; Meshram, Prashant; Anjos, Daniela M.; Yu, Jengyi (2015) -
Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Li, Yunlong; Tokei, Zsolt; Mandrekar, T.; Mebarki, Bencherki; Groeseneken, Guido; Maex, Karen (2005) -
Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, Thomas; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, B.; Maex, Karen (2005) -
Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Li, Yunlong; Cheyns, David; Moreno Hagelsieb, Luis; Georgitzikis, Epimitheas; Lim, Myung jin; Mao, Ming; Witters, Thomas; Leyssens, Kenny; Boulenc, Pierre; Lee, Jiwon; Malinowski, Pawel; Guerrieri, Stefano (2019) -
Colloidal quantum dot image sensors: a new vision for infrared
Malinowski, Pawel; Pejovic, Vladimir; Georgitzikis, Epimitheas; Kim, Joo Hyoung; Lieberman, Itai; Papadopoulos, Nikolas; Lim, Myung Jin; Moreno Hagelsieb, Luis; Chandrasekaran, Naresh; Puybaret, Renaud; Li, Yunlong; Verschooten, Tom; Thijs, Steven; Cheyns, David; Heremans, Paul; Lee, Jiwon (2022) -
Considering percolation path growth in low-k dielectric TDDB measurements
Wu, Chen; Li, Yunlong; Tokei, Zsolt; Croes, Kristof (2017) -
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi (2016) -
Copper electromigration failure times evaluated over a wide range of voiding phases
Li, Yunlong; Croes, Kristof; Kirimura, Tomoyuki; Siew, Yong Kong; Tokei, Zsolt (2012) -
Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Li, Yunlong; Heylen, Nancy; Delande, Tinne; Kellens, Kristof; Ong, Patrick; Leunissen, Peter; Tarnowka, Alexandre; Eliyahu, Aviv (2009-03) -
Demonstration of a cost effective Cu electroless TSV metallization scheme
Vandersmissen, Kevin; Inoue, Fumihiro; Velenis, Dimitrios; Li, Yunlong; Dictus, Dries; Frees, Bart; Van Huylenbroeck, Stefaan; Kondo, M.; Seino, T.; Heylen, Nancy; Struyf, Herbert; van der Veen, Marleen (2015) -
Dielectric reliability of highly scaled through silicon via for wafer level 3D-SoC applications
Li, Yunlong; Van Huylenbroeck, Stefaan; De Vos, Joeri; Wu, Chen; Stucchi, Michele; Croes, Kristof; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2018) -
Electrical characterization method to study barrier integrity in 3D through-silicon vias
Li, Yunlong; Velenis, Dimitrios; Kauerauf, Thomas; Stucchi, Michele; Civale, Yann; Redolfi, Augusto; Croes, Kristof (2012) -
Electrical resistivity and contact resistance in carbon nanotube vertical interconnects
Chiodarelli, Nicolo; Li, Yunlong; Arstila, Kai; Richard, Olivier; Cott, Daire; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2010) -
Electrochemical, physical, and electrical characterization of two clean solutions for Cu PCMP clean
Li, Yunlong; Heylen, Nancy; Daviot, Jerome; Reid, Chris; Leunissen, Peter (2010) -
Establishing the relationship between low-k dielectric properties and intrinsic conduction and degradation mechanisms
Wu, Chen; Li, Yunlong; Croes, Kristof (2017) -
Galvanic corrosion issues related to copper/barrier CMP via inline electrochemical measurements
Teugels, Lieve; Nagar, Magi; Li, Yunlong; Heylen, Nancy (2010) -
High image quality QD image sensors for the SWIR range
Malinowski, Pawel; Georgitzikis, Epimitheas; Pejovic, Vladimir; Moreno Hagelsieb, Luis; Uytterhoeven, Griet; Lee, Jiwon; Li, Yunlong; Thijs, Steven; Verschooten, Tom; Lim, Myung jin; Lieberman, Itai; Cheyns, David (2020)