Browsing Conference contributions by imec author "5c0fec0d8a3a459341d1a475d96ed2ac570d4bd7"

Now showing items 1-17 of 17

    • 21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization 

      Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019)

    • Alternative metal recess for fully-self-aligned-vias 

      Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020)

    • Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node 

      Gupta, Anshul; Mertens, Hans; Tao, Zheng; Demuynck, Steven; Boemmels, Juergen; Arutchelvan, Goutham; Devriendt, Katia; Varela Pedreira, Olalla; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Zahedmanesh, Houman; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, N.; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Yakimets, Dmitry; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Cousserier, Joris; Jaysankar, Manoj; Lazzarino, Frederic; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Tokei, Zsolt; Horiguchi, Naoto (2020)

    • CMOS area scaling and the need for high aspect ratio vias 

      Briggs, Basoene; Guissi, Sofiane; Wilson, Chris; Ryckaert, Julien; Paolillo, Sara; Vandersmissen, Kevin; Versluijs, Janko; Lorant, Christophe; Heylen, Nancy; Boemmels, Juergen; Tokei, Zsolt; Sherazi, Yasser; Weckx, Pieter; Kljucar, Luka; van der Veen, Marleen; Boccardi, Guillaume; De Heyn, Vincent; Gupta, Anshul; Ervin, Joseph; Kamon, Matt (2018)

    • Direct metal etch evaluation for advanced interconnect 

      Paolillo, Sara; Lazzarino, Frederic; Rassoul, Nouredine; Wan, Danny; Piumi, Daniele; Tokei, Zsolt (2017)

    • Exploration of a low-temperature PEALD technology to trim and smooth 193i photoresist 

      Lazzarino, Frederic; Paolillo, Sara; Antony, Peter; De Roest, David; Seong, TaeGeun; Wu, Yizhi; Decoster, Stefan; Rutigliani, Vito; Lorusso, Gian; Constantoudis, Vassilios; Van Elshocht, Sven; Piumi, Daniele; Barla, Kathy (2017)

    • Exploring resist options for EUV layers of IMEC N5 CMOS vehicle 

      Thiam, Arame; Paolillo, Sara; Lazzarino, Frederic; Ercken, Monique; Wong, Patrick; Charley, Anne-Laure (2019)

    • Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck 

      Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020)

    • Large area EUV via yield analysis for single damascene process: voltage contrast, CD and defect metrology 

      Blanco, Victor; Paolillo, Sara; van der Veen, Marleen; Lariviere, Stephane; Lorusso, Gian; De Poortere, Etienne; Tabery, Cyrus; Qiao, Fu; Lai, Shu-yu; Kea, Marc; Wang, Luke; Su, Yu Chi; Oh, Joe; Huang, Jim; Chen, Jimmy; Huang, Jonathan (2019)

    • Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications 

      Moussa, Alain; Saib, Mohamed; Paolillo, Sara; Lazzarino, Frederic; Illiberi, Andrea; Maes, Jan; Deng, Shaoren; Charley, Anne-Laure; Leray, Philippe (2019)

    • N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV 

      Lariviere, Stephane; Briggs, Basoene; Wilson, Chris; Mallik, Arindam; Decoster, Stefan; Wan, Danny; Bekaert, Joost; Blanco, Victor; Mao, Ming; Paolillo, Sara; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Boemmels, Juergen; Trivkovic, Darko; Tokei, Zsolt; McIntyre, Greg; Mocuta, Dan (2017)

    • N5 technology node dual-damascene interconnects enabled using multi patterning 

      Briggs, Basoene; Wilson, Chris; Devriendt, Katia; van der Veen, Marleen; Decoster, Stefan; Paolillo, Sara; Versluijs, Janko; Kesters, Els; Sebaai, Farid; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Verdonck, Patrick; Wan, Danny; Varela Pedreira, Olalla; Croes, Kristof; Dutta, Shibesh; Ryckaert, Julien; Mallik, Arindam; Lariviere, Stephane; Boemmels, Juergen; Tokei, Zsolt (2017)

    • Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node 

      Decoster, Stefan; Paolillo, Sara; Kesters, Els; Briggs, Basoene; van der Veen, Marleen; Lazzarino, Frederic; Piumi, Daniele; Yamashita, Fumiko; Demand, Marc; Kumar, Kaushik (2016)

    • Single exposure EUV patterning for BEOL metal layers on the imec iN7 platform 

      Blanco, Victor; Bekaert, Joost; Mao, Ming; Kutrzeba Kotowska, Bogumila; Lariviere, Stephane; Ciofi, Ivan; Baert, Rogier; Kim, Ryan Ryoung han; Gallagher, Emily; Hendrickx, Eric; Tan, Ling Ee; Gillijns, Werner; Trivkovic, Darko; Leray, Philippe; Halder, Sandip; Gallagher, Matt; Lazzarino, Frederic; Paolillo, Sara; Wan, Danny; Mallik, Arindam; Sherazi, Yasser; McIntyre, Greg; Dusa, Mircea; Rusu, Paul; Hollink, Thijs; Fliervoet, Timon; Wittebrood, Friso (2017)

    • Subtractive etch of ruthenium for sub-5nm interconnect 

      Wan, Danny; Paolillo, Sara; Rassoul, Nouredine; Kutrzeba Kotowska, Bogumila; Blanco, Victor; Adelmann, Christoph; Lazzarino, Frederic; Ercken, Monique; Murdoch, Gayle; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt (2018)

    • Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium 

      Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)

    • Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node 

      Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019)