Browsing Conference contributions by author "Waeterloos, Joost"

A feasibility study of dual damascene porous SiLK resin with spin-on hard masks

Hoofman, Romano; Michelon, Julien; Verheijden, G.J.A.M.; Waeterloos, Joost; Caluwaerts, Rudy; Schmidt, M.O.; Demeurisse, Caroline; Vandeweyer, Tom; Demuynck, Steven; Tokei, Zsolt; Beyer, Gerald (2004)

Barrier process development for damascene integration of porous SiLK resin films

Tokei, Zsolt; Waeterloos, Joost; Iacopi, Francesca; Caluwaerts, Rudy; Struyf, Herbert; Van Aelst, Joke; Maex, Karen (2002)

Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin

Lemaire, J. J.; Rajagopal, A.; Gregoire, C.; Pireaux, J. J.; Baklanov, Mikhaïl; Vanhaelemeersch, Serge; Maex, Karen; Waeterloos, Joost (1999)

Damascene integration feasability of porous SiLK resin films

Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Das, Arabinda; Caluwaerts, Rudy; Alaerts, Carine; Boullart, Werner; Tokei, Zsolt; Van Hove, Marleen; Maex, Karen (2002)

Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma

Thompson, Heike; Vanhaelemeersch, Serge; Maex, Karen; Van Ammel, Annemie; Beyer, Gerald; Coenegrachts, Bart; Vervoort, Iwan; Waeterloos, Joost; Struyf, Herbert; Palmans, Roger; Forester, Lynn (1999)

Increasing DOF for VIA lithography using a non-CMP based architecture

Grozev, Grozdan; Waeterloos, Joost; Ronse, Kurt; Van den hove, Luc; Tzviatkov, Plamen (1997)

Integrating a hydrogen silsesquioxane spin-on dielectric in a quarter micron technology

Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Gao, Teng; Grillaert, Joost; Van den hove, Luc (1997)

Integration feasibility of porous SiLK semiconductor dielectric

Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Castillo, D. W.; Lucero, S.; Caluwaerts, Rudy; Alaerts, Carine; Mannaert, Geert; Boullart, Werner; Sleeckx, Erik; Schaekers, Marc; Tokei, Zsolt; Vervoort, Iwan; Steenbergen, Johnny; Sijmus, Bram; Vos, I.; Meuris, Marc; Iacopi, Francesca; Donaton, R (2001)

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Waeterloos, Joost; Shaffer, E. O.; Stokich, T.; Hetzner, J.; Price, D.; Booms, L.; Donaton, R. A.; Beyer, Gerald; Coenegrachts, Bart; Caluwaerts, Rudy; Struyf, Herbert; Tokei, Zsolt; Vervoort, Iwan; Sjjmus, B.; Vos, I.; Maex, Karen; Komiya, Takayuki; Iwashita, J. M. (2001)

Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure

Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Van Hove, Marleen; Maex, Karen; Yang, Jiping; Wang, Sharon; Forester, Lynn (1999)

Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process

Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998)

Low-k organic spin-on materials in a non-etchback interconnect strategy

Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Grillaert, Joost; Van den hove, Luc (1996)

Mechanical analysis of a SiLK/Cu dual damascene interconnect system

Waeterloos, Joost; Shaffer, E.; Stokich, T.; Alves Donaton, Ricardo; Maex, Karen (2001)

Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables

Grillaert, Joost; Meynen, Herman; Waeterloos, Joost; Coenegrachts, Bart; Van den hove, Luc (1997)

Post patterning meso porosity creation: a potential solution for pore sealing

Caluwaerts, Rudy; Van Hove, Marleen; Beyer, Gerald; Hoofman, Romano; Struyf, Herbert; Brom - Verheyden, Greja; Waeterloos, Joost; Tokei, Zsolt; Iacopi, Francesca; Carbonell, Laure; Le, Quoc Toan; Das, Arabinda; Vos, Ingrid; Demuynck, Steven; Maex, Karen (2003)