Browsing Articles by imec author "16ae8db2f870dcb03f423a4e5c30e3509c6aa3c8"
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Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits
Haesevoets, Karel; Radisic, Alex; Vereecken, Philippe (2019) -
Differential inhibition during Cu electrodeposition on Ru: combined electrochemical and real-time TEM studies
Vereecken, Philippe; Radisic, Alex; Ross, Frances (2019) -
Electrochemical fabrication of platinum interconnects for implantable electronic devices
Radisic, Alex; Morcos, Bishoy; Op de Beeck, Maaike; O'Callaghan, John; Van Hoof, Chris (2014) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017) -
Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Electrolytic manganese dioxide coatings on high aspect ratio micro-pillar arrays for 3D thin film lithium ion batteries
Zargouni, Yafa; Deheryan, Stella; Radisic, Alex; Alouani, Khaled; Vereecken, Philippe (2017) -
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Druais, Gael; Dilliway, G.; Fischer, P.; Guidotti, E.; Luhn, Ole; Radisic, Alex; Zahraoui, S. (2008) -
Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2011) -
Improving the copper electroplating process for 3D-stacked integrated circuits
Luhn, Ole; Radisic, Alex; Ruythooren, Wouter; Vereecken, Philippe; Celis, Jean-Pierre; Van Hoof, Chris; Swinnen, Bart (2008) -
Island growth in electrodeposition
Guo, Lian; Oskam, Gerko; Radisic, Alex; Hoffmann, Peter; Searson, Peter (2011) -
Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Monitoring the superfilling of blind holes with electrodeposited copper
Luhn, Ole; Radisic, Alex; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2010) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Vereecken, Philippe; West, Alan (2012) -
Nanometer-thin graphitic carbon buffer layers for electrolytic MnO2 for thin-film energy storage devices
Deheryan, Stella; Zargouni, Yafa; Sinha, Rochan; Put, Brecht; Radisic, Alex; Heyns, Marc; Vereecken, Philippe (2017) -
Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits
Van Bavel, Mieke; Luhn, Ole; Radisic, Alex; Ruythooren, Wouter (2008) -
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
Yang, Yu; Labie, Riet; Ling, Fangzhou; Zhao, Chao; Radisic, Alex; Van Olmen, Jan; Travaly, Youssef; Verlinden, Bert; De Wolf, Ingrid (2010) -
Stochastic modeling of polyethylene glycol as a suppressor in copper electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2014)