Browsing Articles by imec author "4bbc203dc5451ab5a42627cf713d1b4125d3c0c1"
Now showing items 1-20 of 61
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A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication
Kruv, Anastasiia; Gonzalez, Mario; Okudur, Oguzhan Orkut; Spampinato, Valentina; Franquet, Alexis; Vadakupudhu Palayam, Senthil; Arreghini, Antonio; Van den Bosch, Geert; Rosmeulen, Maarten; De Wolf, Ingrid (2022) -
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Lofrano, Melina; Gonzalez, Mario; Vandevelde, Bart (2014) -
A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2016) -
Advanced experimental Back-End-Of-Line (BEOL) stability test: measurements and simulations
Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; De Wolf, Ingrid; Van der Plas, Geert; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2015) -
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
Salahouelhadj, Abdellah; Gonzalez, Mario; Vanstreels, Kris; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2023) -
B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages
Cowley, A.; Ivankovic, A.; Wong, C.S; Bennett, N.S.; Danilewsky, A.N.; Gonzalez, Mario; Cherman, Vladimir; Vandevelde, Bart; De Wolf, Ingrid; McNally, P.J. (2016) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Bleifreies Löten und FEM-Modellierung
Snoeckx, Koen; Gonzalez, Mario (2005-10) -
Characterization and FE analysis on the shear test of electronic materials
Gonzalez, Mario; Vandevelde, Bart; Van Hoof, Rita; Beyne, Eric (2004-12) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy
Jacobs, Kristof J.P.; Stucchi, Michele; Afanasiev, Valeri; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Beyne, Eric (2018) -
Design and analysis of a novel fine pitch and highly stretchable interconnect
Hsu, Yung-Yu; Gonzalez, Mario; Bossuyt, Frederick; Axisa, Fabrice; Vanfleteren, Jan; Vandevelde, Bart; De Wolf, Ingrid (2010) -
Design and fabrication of elastic interconnections for stretchable electronic circuits
Brosteaux, Dominique; Axisa, Fabrice; Gonzalez, Mario; Vanfleteren, Jan (2007) -
Design and implementation of flexible and stretchable systems
Gonzalez, Mario; Vandevelde, Bart; Christiaens, Wim; Hsu, Yung-Yu; Iker, Francois; Bossuyt, Frederick; van der Sluis, Olaf; Timmermans, P.H.M. (2011) -
Design and performance of metal conductors for stretchable electronic circuits
Gonzalez, Mario; Axisa, Fabrice; Bossuyt, Frederick; Hsu, Yung-Yu; Vandevelde, Bart; Vanfleteren, Jan (2009) -
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Design of metal interconnects for stretchable electronic circuits
Gonzalez, Mario; Axisa, Fabrice; Vanden Bulcke, Mathieu; Brosteaux, Dominique; Vandevelde, Bart; Vanfleteren, Jan (2008) -
Developing an advanced module for back-contact solar cells
Govaerts, Jonathan; Robbelein, Jo; Gonzalez, Mario; Gordon, Ivan; Baert, Kris; De Wolf, Ingrid; Bossuyt, Frederick; Van Put, Steven; Vanfleteren, Jan (2011) -
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Kljucar, Luka; Gonzalez, Mario; Vanstreels, Kris; Ivankovic, Andrej; Hecker, Michael; De Wolf, Ingrid (2015)