Browsing Presentations by imec author "e576afbf43add4095143c6322cedb3ccde8f2762"
Now showing items 1-20 of 90
-
A comparative study of copper drift diffusion in plasma deposited A-Sic:H and silicon nitride
Lanckmans, Filip; Gray, William; Brijs, Bert; Maex, Karen (2000) -
A modified capacitance/voltage technique to characterize copper drift diffusion in organic low-K dielectrics
Lanckmans, Filip; Geenen, Luc; Vandervorst, Wilfried; Maex, Karen (1999) -
A novel approach to characterization of a low-k dielectric polymer surface
Martin Hoyas, Ana; Schuhmacher, Jorg; Whelan, Caroline; Baklanov, Mikhaïl; Carbonell, Laure; Schaekers, Marc; Celis, Jean-Pierre; Maex, Karen (2002) -
A novel approach to the short stripe effect in electromigration: modeling and experiment
Glickman, E.; Proost, Joris; Maex, Karen; Nathan, M.; Delaey, L. (2000) -
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Beyne, Eric; Maex, Karen (2000) -
Adhesion study between materials for integration of copper and inorganic low-k dielectrics
Lanckmans, Filip; Brongersma, Sywert; Poortmans, Jef; Conard, Thierry; Bender, Hugo; Beyne, Eric; Maex, Karen (2001) -
Advanced solutions for copper and low k technology
Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2003) -
Barrier reliability on sub-100nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, T.; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, Bencherki; Maex, Karen (2004) -
Buckling instabilities of thin cap layers deposited onto low-k dielectric films
Iacopi, Francesca; Brongersma, Sywert; Maex, Karen; Abell, Thomas (2002) -
Characterisation of plasma etch related residues formed on top of ECD Cu
Baklanov, Mikhaïl; Conard, Thierry; Lanckmans, Filip; Vanhaelemeersch, Serge; Holmes, D.; Maex, Karen (1999) -
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
Li, H.; Heyvaert, Ilse; Jin, S.; Lanckmans, Filip; Bender, Hugo; Maex, Karen; Froyen, L. (1998) -
Characterization of ALD diffusion barrier on low-k dielectric polymer by contact angle measurements
Martin Hoyas, Ana; Schuhmacher, Jorg; Celis, Jean-Pierre; Maex, Karen (2002) -
Characterization of HF-last cleaning of ion-implanted Si surfaces
Kondoh, Eiichi; Baklanov, Mikhaïl; Maex, Karen (1998) -
Characterization of the growth of atomic layer deposited WNxCy films on various substrates
Martin Hoyas, Ana; Travaly, Youssef; Schuhmacher, Jorg; Sajavaara, Timo; Whelan, Caroline; Eyckens, Brenda; Richard, Olivier; Giangrandi,; Brijs, Bert; Jonas, A.M.; Vantomme, Andre; Vandervorst, Wilfried; Celis, Jean-Pierre; Maex, Karen (2005) -
Comparative study of Ni-silicide and Co-silicide for sub 0.25 μm technologies
Lauwers, A.; Besser, Paul; Gutt, T.; Satta, Alessandra; de Potter de ten Broeck, Muriel; Lindsay, Richard; Roelandts, Nico; Loosen, Fred; Stucchi, Michele; Vrancken, Christa; Deweerdt, Bruno; Maex, Karen (1999) -
Comparison of Co silicidation on SiGe and SiGeC alloys
Donaton, R. A.; Maex, Karen; Vantomme, Andre; St. Amour, A.; Sturm, J. C. (1996) -
Composite nanoparticles for defectivity reduction during CMP
Armini, Silvia; Terzieva, Valentina; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Continued scalability of copper/low-k interconnects
Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005) -
Controlling CoSi2 nucleation: the effect of entropy of mixing
Detavernier, C.; Van Meirhaeghe, R. L.; Maex, Karen; Cardon, F. (2000)