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Browsing by Author "Abell, Thomas"

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    A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

    Travaly, Youssef
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    Schuhmacher, Jorg
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    Baklanov, Mikhaïl
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    Giangrandi, Simone
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    Richard, Olivier  
    Journal article
    2005-10, Journal of Applied Physics, (98) 8, p.083515-1-083515-9
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    Atomic layer deposited barriers for copper interconnects

    Schuhmacher, Jorg
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    Martin Hoyas, Ana
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    Ernur, Didem  
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    Tokei, Zsolt  
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    Travaly, Youssef
    Meeting abstract
    2004, AVS 51 International Symposium, 14/11/2004, p.TF-MoM1
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    Atomic layer deposition of barriers for interconnect

    Besling, Wim
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    Satta, Alessandra
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    Schuhmacher, Jörg
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    Abell, Thomas
    ;
    Sutcliffe, Victor
    Proceedings paper
    2002, Proceedings of the IEEE International Interconnect Technology Conference, 3/06/2002, p.288-291
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    Buckling instabilities of thin cap layers deposited onto low-k dielectric films

    Iacopi, Francesca
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    Brongersma, Sywert  
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    Maex, Karen  
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    Abell, Thomas
    Oral presentation
    2002, MRS Fall Meeting Symposium B: Polymer/Metal Interfaces - Fundamentals, Properties, and Applications
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    Buckling instabilities of thin cap layers deposited onto low-k dielectric films

    Iacopi, Francesca
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    Brongersma, Sywert  
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    Abell, Thomas
    ;
    Maex, Karen  
    Proceedings paper
    2003, Polymer/Metal Interfaces and Defect Mediated Phenomena in Ordered Polymers, 2/12/2002, p.383-388
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    Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material

    Travaly, Youssef
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    Kemeling, N.
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    Maenhoudt, Mireille
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    Peeters, S.
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    Tokei, Zsolt  
    ;
    Abell, Thomas
    Proceedings paper
    2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728
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    Comparison of modulus and density measurements by nanoidentation, SAWS, XRR and EP techniques of a porous low k MSQ dielectric

    Abell, Thomas
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    Iacopi, Francesca
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    Prokopowicz, Greg
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    Sun, Brad
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    Mazurenko, Alex
    Proceedings paper
    2005-01, Advanced Metallization Conference 2004, 19/10/2004, p.457-462
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    Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics

    Abell, Thomas
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    Shamiryan, Denis
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    Patz, Matthias
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    Maex, Karen  
    Oral presentation
    2003, Advanced Metallization Conference
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    Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics

    Abell, Thomas
    ;
    Shamiryan, Denis
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    Patz, Matthias
    ;
    Maex, Karen  
    Proceedings paper
    2004, Advanced Metallization Conference 2003, 21/10/2003, p.549-553
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    Damage minimized plasma pore sealing of microporous low k dielectrics

    Abell, Thomas
    ;
    Maex, Karen  
    Journal article
    2004, Microelectronic Engineering, (76) 1_4, p.16-19
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    Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films

    Iacopi, Francesca
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    Waldfried, Carlo
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    Abell, Thomas
    ;
    Guyer, Eric
    ;
    Eyckens, Brenda
    Oral presentation
    2005, MRS Spring Meeting Symposium B: Materials, Technology and Reliability of Advanced Interconnects
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    Efficient pore sealing crucial for future interconnects

    Van Bavel, Mieke  
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    Beyer, Gerald  
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    Iacopi, Francesca
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    Abell, Thomas
    ;
    Shamiryan, Denis
    ;
    Maex, Karen  
    Journal article
    2004, Future Fab, 16, p.111-114
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    Interface characterization of nanoscale laminate structures on dense dielectric substrates by X-ray reflectivity

    Travaly, Youssef
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    Schuhmacher, Jorg
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    Martin Hoyas, Ana
    ;
    Van Hove, Marleen
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    Maex, Karen  
    Journal article
    2005-04, Journal of Applied Physics, (97) 8, p.84316
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    Interface characterization of nanoscale laminate structures on dense dielectric substrates by x-ray reflectivity

    Travaly, Youssef
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    Schuhmacher, Jorg
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    Martin Hoyas, Ana
    ;
    Van Hove, Marleen
    ;
    Maex, Karen  
    Journal article
    2005-04, Virtual Journal of Nanoscale Science and Technology, (11) 16
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    Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure

    Abell, Thomas
    ;
    Schuhmacher, Jorg
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    Tokei, Zsolt  
    ;
    Travaly, Youssef
    ;
    Maex, Karen  
    Journal article
    2005, Microelectronic Engineering, (82) 3_4, p.411-415
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    Low-k dielectric materials

    Shamiryan, Denis
    ;
    Abell, Thomas
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    Iacopi, Francesca
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    Maex, Karen  
    Journal article
    2004, Materials Today, (7) 1, p.34-39
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    Nucleation and growth dependence of ALD WNC on substrate surface condition

    Abell, Thomas
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    Schuhmacher, Jörg
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    Travaly, Youssef
    ;
    Maex, Karen  
    Proceedings paper
    2004, Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics, 12/04/2004, p.141-146
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    Opportunities and challenges for integration of ALD barrier layers in damascene process flows

    Sprey, Hessel  
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    Schuhmacher, Jorg
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    Travaly, Youssef
    ;
    Sutcliffe, Victor
    ;
    Abell, Thomas
    Proceedings paper
    2004, Atomic Layer Deposition Conference, 16/08/2004
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    Pinhole density measurements of barriers deposited on low-k films

    Shamiryan, Denis
    ;
    Abell, Thomas
    ;
    Le, Quoc Toan  
    ;
    Maex, Karen  
    Journal article
    2003-11, Microelectronic Engineering, (70) 2_4, p.341-345
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    Precursor penetration and sealing of porous CVD SiCOH low k dielectric for atomic layer deposition of WCxNy

    Abell, Thomas
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    Shamiryan, Denis
    ;
    Schuhmacher, Jörg
    ;
    Besling, W.
    ;
    Sutcliffe, V.
    ;
    Maex, Karen  
    Proceedings paper
    2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.717-723
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