Browsing by Author "Abell, Thomas"
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Publication A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates
Journal article2005-10, Journal of Applied Physics, (98) 8, p.083515-1-083515-9Publication Atomic layer deposited barriers for copper interconnects
Meeting abstract2004, AVS 51 International Symposium, 14/11/2004, p.TF-MoM1Publication Atomic layer deposition of barriers for interconnect
;Besling, Wim ;Satta, Alessandra ;Schuhmacher, Jörg ;Abell, ThomasSutcliffe, VictorProceedings paper2002, Proceedings of the IEEE International Interconnect Technology Conference, 3/06/2002, p.288-291Publication Buckling instabilities of thin cap layers deposited onto low-k dielectric films
Oral presentation2002, MRS Fall Meeting Symposium B: Polymer/Metal Interfaces - Fundamentals, Properties, and ApplicationsPublication Buckling instabilities of thin cap layers deposited onto low-k dielectric films
Proceedings paper2003, Polymer/Metal Interfaces and Defect Mediated Phenomena in Ordered Polymers, 2/12/2002, p.383-388Publication Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728Publication Comparison of modulus and density measurements by nanoidentation, SAWS, XRR and EP techniques of a porous low k MSQ dielectric
;Abell, Thomas ;Iacopi, Francesca ;Prokopowicz, Greg ;Sun, BradMazurenko, AlexProceedings paper2005-01, Advanced Metallization Conference 2004, 19/10/2004, p.457-462Publication Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
Oral presentation2003, Advanced Metallization ConferencePublication Correlation between solvent diffusion, porosity and pore sealing for low k dielectrics
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.549-553Publication Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films
;Iacopi, Francesca ;Waldfried, Carlo ;Abell, Thomas ;Guyer, EricEyckens, BrendaOral presentation2005, MRS Spring Meeting Symposium B: Materials, Technology and Reliability of Advanced InterconnectsPublication Efficient pore sealing crucial for future interconnects
Journal article2004, Future Fab, 16, p.111-114Publication Interface characterization of nanoscale laminate structures on dense dielectric substrates by X-ray reflectivity
Journal article2005-04, Journal of Applied Physics, (97) 8, p.84316Publication Interface characterization of nanoscale laminate structures on dense dielectric substrates by x-ray reflectivity
Journal article2005-04, Virtual Journal of Nanoscale Science and Technology, (11) 16Publication Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure
Journal article2005, Microelectronic Engineering, (82) 3_4, p.411-415Publication Nucleation and growth dependence of ALD WNC on substrate surface condition
Proceedings paper2004, Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics, 12/04/2004, p.141-146Publication Opportunities and challenges for integration of ALD barrier layers in damascene process flows
Proceedings paper2004, Atomic Layer Deposition Conference, 16/08/2004Publication Pinhole density measurements of barriers deposited on low-k films
Journal article2003-11, Microelectronic Engineering, (70) 2_4, p.341-345Publication Precursor penetration and sealing of porous CVD SiCOH low k dielectric for atomic layer deposition of WCxNy
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.717-723