Browsing by Author "Brouri, Mohand"
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Publication 30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning
Journal article2009, Journal of Micro/Nanolithography MEMS MOEMS, (8) 1, p.11007Publication 30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning
Proceedings paper2008, Optical Microlithography XXI, 24/02/2008, p.69242CPublication A DC-pulsed capacitively-coupled planar Langmuir probe for plasma process diagnostics and monitoring
Journal article2012, Plasma Sources Science and Technology, (21) 6, p.65004Publication A way to integrate multiple block layers for middle of line contact patterning
Proceedings paper2015, Advanced Etch Technology for Nanopattering IV, 22/02/2015, p.94280WPublication Advanced metallization scheme for 3×50μm via middle TSV and beyond
; ; ; ; ; Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.66-72Publication C2H4-based plasma-assisted CD shrink and contact patterning for RRAM application
; ; ; ; Shamiryan, DenisProceedings paper2010, Advanced Interconnects and Chemical Planarization for Micro- and Nanoelectronics, 5/04/2010, p.F04.09Publication Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Dependence of etching rate on aspect ratio for high aspect TSV etching
Publication Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter
Journal article2016, Microelectronic Engineering, 156, p.37-40Publication Effect of precoat on the sidewall profile of through silicon via's
Meeting abstract2013, Plasma Etch and Strip in Microtechnology - PESM, 14/03/2013Publication Exploring high aspEct ratio 2μm TSV (25:1)
Proceedings paper2011-11, 64th Annual Gaseous Electronics Conference - GEC, 14/11/2011Publication N7 middle of line etch challenges and solutions
Meeting abstract2015, Plasma Etch and Strip in Microtechnology - PESM, 27/04/2015Publication Overlay Metrology Performance of Dry Photoresist Towards High NA EUV Lithography
Proceedings paper2024, Conference on Metrology, Inspection, and Process Control XXXVIII, FEB 26-29, 2024, p.Art. 129551RPublication Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below
Proceedings paper2015, International Interconnect Technology Conference - IITC and Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.327-330Publication Resistance and capacitance measurements of the films deposited on a planar Langmuir probe
Proceedings paper2011-11, 64th Gaseous Electronics Conference, 14/11/2011