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Browsing by Author "Hung, Joey"

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    300 mm-wafer characterization of ruthenium area-selective deposition in nanoscale line-space and hole patterns

    Clerix, Jan-Willem  
    ;
    Delabie, Annelies  
    ;
    Hung, Joey  
    ;
    Warad, L.
    ;
    Shah, Kavita
    Meeting abstract
    2020, 20th International Conference on Atomic Layer Deposition, 2/04/2020, p.AS-TuP-14
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    Co and Ru dual damascene compatible metallization studies

    van der Veen, Marleen  
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    Heylen, Nancy  
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    Lariviere, Stephane  
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    Vega Gonzalez, Victor  
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    Kesters, Els  
    Proceedings paper
    2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.2.2
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    First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

    Subramanian, Sujith  
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    Hosseini, Maryam  
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    Chiarella, Thomas  
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    Sarkar, Satadru  
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    Schuddinck, Pieter  
    Proceedings paper
    2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020
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    Metrology of Thin Resist for High NA EUVL

    Lorusso, Gian  
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    Beral, Christophe  
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    Bogdanowicz, Janusz  
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    De Simone, Danilo  
    ;
    Hasan, Mahmudul  
    Proceedings paper
    2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.12053OO
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    Plasma halogenated amorphous carbon as growth inhibiting layer for area-selective deposition of titanium oxide

    Krishtab, Mikhail  
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    Hung, Joey  
    ;
    Koret, Roy
    ;
    Turovets, Igor
    ;
    Shah, Kavita
    ;
    Rangarajan, Srinivasan
    Proceedings paper
    2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.113250Y
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    Scatterometry and AFM measurement combination for area selective deposition process characterization

    Saib, Mohamed  
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    Moussa, Alain  
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    Charley, Anne-Laure  
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    Leray, Philippe  
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    Hung, Joey  
    ;
    Koret, Roy
    Proceedings paper
    2019, Metrology, Inspection, and Process Control for Microlithography XXXIII, 24/02/2019, p.109591N
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    Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing

    Chew, Soon Aik  
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    Hung, Joey
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    Turovets, Igor
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    Saib, Mohamed  
    ;
    Ger, Avron
    ;
    Moussa, Alain  
    ;
    Zhang, Boyao  
    Proceedings paper
    2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024
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    Scatterometry solutions for 14nm half-pitch BEOL layers patterned by EUV single exposure

    Das, Sayantan  
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    Hung, Joey  
    ;
    Halder, Sandip  
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    Koret, Roy
    ;
    Turovets, Igor
    ;
    Charley, Anne-Laure  
    Proceedings paper
    2021, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 22/02/2021, p.116112A
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    Spectroscopy: A new route towards critical-dimension metrology of the cavity etch of nanosheet transistors

    Bogdanowicz, Janusz  
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    Oniki, Yusuke  
    ;
    Kenis, Karine  
    ;
    Muraki, Yusuke  
    ;
    Nuytten, Thomas  
    Proceedings paper
    2021, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 21/02/2021, p.116111Q

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