Browsing by Author "Hung, Joey"
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Publication 300 mm-wafer characterization of ruthenium area-selective deposition in nanoscale line-space and hole patterns
Meeting abstract2020, 20th International Conference on Atomic Layer Deposition, 2/04/2020, p.AS-TuP-14Publication Co and Ru dual damascene compatible metallization studies
Proceedings paper2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.2.2Publication First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Metrology of Thin Resist for High NA EUVL
Proceedings paper2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.12053OOPublication Plasma halogenated amorphous carbon as growth inhibiting layer for area-selective deposition of titanium oxide
Proceedings paper2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.113250YPublication Scatterometry and AFM measurement combination for area selective deposition process characterization
Proceedings paper2019, Metrology, Inspection, and Process Control for Microlithography XXXIII, 24/02/2019, p.109591NPublication Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing
; ;Hung, Joey ;Turovets, Igor; ;Ger, Avron; Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication Scatterometry solutions for 14nm half-pitch BEOL layers patterned by EUV single exposure
Proceedings paper2021, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 22/02/2021, p.116112APublication Spectroscopy: A new route towards critical-dimension metrology of the cavity etch of nanosheet transistors
Proceedings paper2021, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 21/02/2021, p.116111Q