Browsing by Author "Kumar, Kaushik"
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Publication Controlled isotropic etches for Gate-All-Around (GAA) device architectures
Oral presentation2020, Surface Preparation and Cleaning Conference - SPCCPublication Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
Proceedings paper2022-06-29, IITC2022, 2022-06-27Publication Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors
Meeting abstract2019, Advanced Etch Technology for Nanopatterning VIII, 24/02/2019, p.109630LPublication Etch challenges in high aspect ratio aupervia patterning
Proceedings paper2019, 11th PESM-2019, 20/05/2019Publication Etch tool pressure optimization enabling wafer edge overlay control.
Oral presentation2020, ASML Technology Conference 2020Publication Evolution of lithography-to-etch bias in multi-patterning processes
Publication High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond
Meeting abstract2021, AVS 67th International Symposium and Exhibition, 24/10/2021Publication Intra-field etch induced overlay penalties
Proceedings paper2020, Advanced Etch Technology for Nanopatterning IX, 23/02/2020, p.1132910Publication Mitigation of the etch-induced intra-field overlay contribution
Publication On product overlay characterization after stressed layer etch
Proceedings paper2021, Advanced Etch Technology and Process Integration for Nanopatterning X, 21/02/2021, p.116150NPublication Plasma etch selectivity study and material screening for Self-Aligned Gate Contact (SAGC)
Proceedings paper2019, Advanced Etch Technology for Nanopatterning VIII, 24/02/2019, p.109630PPublication Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node
Meeting abstract2016, Plasma Etch and Strip in Microtechnology - PESM, 9/05/2016Publication Selective isotropic etching of Group IV semiconductors to enable gate all around device architectures
Meeting abstract2018, Surface Preparation and Cleaning Conference - SPCC, 10/04/2018Publication Si trim applications: benefits and challenges
Meeting abstract2019, Surface Preparation and Cleaning Conference (SPCC), 2/04/2019