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Browsing by Author "Li, Xiangdong"

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    200 mm industrial-ready dispersion-free GaN-on-Si buffer technology for 650 V rated power application

    Zhao, Ming  
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    Li, Xiangdong  
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    Decoutere, Stefaan  
    Meeting abstract
    2019, 13th International Conference on Nitride Semiconductors 2019 (ICNS-13), 7/07/2019
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    200 V enhancement-mode p-GaN HEMTs fabricated on 200 mm GaN-on-SOI with trench isolation for monolithic integration

    Li, Xiangdong  
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    Van Hove, Marleen
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    Zhao, Ming  
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    Geens, Karen  
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    Lempinen, Vesa-Pekka
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    Sormunen, Jaakko
    Journal article
    2017, IEEE Electron Device Letters, (38) 7, p.918-921
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    200 V enhancement-mode p-GaN HEMTs fabricated on 200 mm GaN-on-SOI with trench isolation for monolithic integration

    Li, Xiangdong  
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    Van Hove, Marleen
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    Zhao, Ming  
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    Geens, Karen  
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    Lempinen, Vesa-Pekka
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    Sormunen, Jaakko
    Proceedings paper
    2017, 41st Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 21/05/2017, p.103-104
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    650 V p-GaN gate power HEMTs on 200 mm engineered substrates

    Geens, Karen  
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    Li, Xiangdong  
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    Zhao, Ming  
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    Guo, Weiming
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    Wellekens, Dirk  
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    Posthuma, Niels  
    Proceedings paper
    2019, 7th Workshop on Wide Bandgap Power Devices and Applications - WIPDA 2019, 29/10/2019, p.292-296
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    A comprehensive study of MOVPE growth on 200 mm GaN-on-SOI for monolithic integrated GaN ICs

    Zhao, Ming  
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    Geens, Karen  
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    Li, Xiangdong  
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    Amirifar, Nooshin  
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    Decoutere, Stefaan  
    Meeting abstract
    2021, 2021 Virtual MRS Spring Meeting, 17/04/2021
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    An E-mode p-GaN HEMT monolithically-integrated three-level gate driver operating with a single voltage supply

    Nagao, Junichiro
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    Chatterjee, Urmimala  
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    Li, Xiangdong  
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    Furuta, Jun
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    Decoutere, Stefaan  
    Journal article
    2021, IEICE ELECTRONICS EXPRESS, (18) 6, p.20210059
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    Analysis of the drain-to-substrate leakage of power HEMTs grown on highly resistive silicon substrate

    Borga, Matteo  
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    Meneghini, Matteo
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    Stoffels, Steve  
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    Van Hove, Marleen
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    Li, Xiangdong  
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    Zhao, Ming  
    Proceedings paper
    2018, GaN Marathon 2.0, 18/04/2018, p.38-39
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    Buffer vertical leakage mechanism and reliability of 200-mm GaN-on-SOI

    Li, Xiangdong  
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    Zhao, Ming  
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    Bakeroot, Benoit  
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    Geens, Karen  
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    Guo, Weiming
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    Lempinen, Vesa-Pekka
    Journal article
    2019, IEEE Transactions on Electron Devices, (66) 1, p.553-536
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    CMOS process-compatible 200mm polycrystalline AlN substrates for GaN power transistors

    Geens, Karen  
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    Van Hove, Marleen
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    Li, Xiangdong  
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    Zhao, Ming  
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    Šatka, Alexander
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    Vincze, Andrej
    Proceedings paper
    2017, Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 21/05/2017, p.97-98
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    Demonstration of GaN integrated half-bridge with on-chip drivers on 200-mm engineered substrates

    Li, Xiangdong  
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    Geens, Karen  
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    Zhao, Ming  
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    You, Shuzhen  
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    Wischmeyer, Frank
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    Odnoblyudov, Vladimir
    Journal article
    2019, IEEE Electron Device Letters, (40) 9, p.1499-1502
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    Epitaxial growth by MOCVD on 200 mm engineered substrates for power devices & ICs beyond 650 V

    Fahle, Dirk
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    Zhao, Ming  
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    Geens, Karen  
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    Li, Xiangdong  
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    Wellekens, Dirk  
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    Magnani, Alessandro  
    Meeting abstract
    2019, DGKK Workshop "Epitaxy of III-V Semiconductors", 5/12/2019
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    Evaluation of novel carrier substrates for high reliability and integrated GaN devices in a 200 mm complementary metal-oxide semiconductor compatible process

    Stoffels, Steve  
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    Geens, Karen  
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    Li, Xiangdong  
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    Wellekens, Dirk  
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    You, Shuzhen  
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    Zhao, Ming  
    Journal article
    2018, MRS Communications, 84, p.1387-1394
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    GaN Device architectures enabled by next generation substrates

    Stoffels, Steve  
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    Geens, Karen  
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    Posthuma, Niels  
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    Zhao, Ming  
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    Liang, Hu  
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    Li, Xiangdong  
    Proceedings paper
    2018, GaN Marathon 2.0, 18/04/2018, p.27-28
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    GaN power IC design using the MIT virtual source GaNFET compact model with gate leakage and V-T instability effect

    You, Shuzhen  
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    Li, Xiangdong  
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    Geens, Karen  
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    Posthuma, Niels  
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    Zhao, Ming  
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    Liang, Hu  
    Journal article
    2021, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, (36) 3, p.035008
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    GaN-on-SOI: Monolithically integrated all GaN ICs for power conversion

    Li, Xiangdong  
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    Amirifar, Nooshin  
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    Geens, Karen  
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    Zhao, Ming  
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    Guo, Weiming
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    Liang, Hu  
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    You, Shuzhen  
    Proceedings paper
    2019, IEEE International Electron Devices Meeting - IEDM, 7/12/2019, p.78-81
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    Impact of crystal orientation on ohmic contact resistance of enhancement-mode pGaN gate high electron mobility transistors on 200 mm Si substrates

    Van Hove, Marleen
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    Posthuma, Niels  
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    Geens, Karen  
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    Wellekens, Dirk  
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    Li, Xiangdong  
    Journal article
    2018, Japanese Journal of Applied Physics, 57, p.04FG02-1-04FG02-4
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    Impact of substrate resistivity on the vertical leakage, breakdown, and trapping in GaN-on-Si E-Mode HEMTs

    Borga, Matteo  
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    Meneghini, Matteo
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    Stoffels, Steve  
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    Li, Xiangdong  
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    Posthuma, Niels  
    Journal article
    2018, IEEE Transactions on Electron Devices, (65) 7, p.2765-2770
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    Impact of the substrate and buffer design on the performance of GaN on Si

    Borga, Matteo  
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    Meneghini, Matteo
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    Stoffels, Steve  
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    Van Hove, Marleen
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    Zhao, Ming  
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    Li, Xiangdong  
    Journal article
    2018, Microelectronics Reliability, (88) 90, p.584-588
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    Influence of driver integration on GaN enhancement mode transistor performance

    Deckers, Martijn
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    Ravyts, Simon
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    Dalla Vecchia, Mauricio
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    Chatterjee, Urmimala  
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    Li, Xiangdong  
    Proceedings paper
    2020, 21st IEEE Workshop on Control and Modeling for Power Electronics - COMPEL, 9/11/2020
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    Influence of Driver Integration on GaN Enhancement Mode Transistor Performance

    Deckers, Martijn
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    Ravyts, Simon
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    Dalla Vecchia, Mauricio
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    Chatterjee, Urmimala  
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    Li, Xiangdong  
    Proceedings paper
    2020, IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), NOV 09-12, 2020, p.480-485
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