Browsing by Author "Li, Xiangdong"
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Publication 200 mm industrial-ready dispersion-free GaN-on-Si buffer technology for 650 V rated power application
Meeting abstract2019, 13th International Conference on Nitride Semiconductors 2019 (ICNS-13), 7/07/2019Publication 200 V enhancement-mode p-GaN HEMTs fabricated on 200 mm GaN-on-SOI with trench isolation for monolithic integration
; ;Van Hove, Marleen; ; ;Lempinen, Vesa-PekkaSormunen, JaakkoJournal article2017, IEEE Electron Device Letters, (38) 7, p.918-921Publication 200 V enhancement-mode p-GaN HEMTs fabricated on 200 mm GaN-on-SOI with trench isolation for monolithic integration
; ;Van Hove, Marleen; ; ;Lempinen, Vesa-PekkaSormunen, JaakkoProceedings paper2017, 41st Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 21/05/2017, p.103-104Publication 650 V p-GaN gate power HEMTs on 200 mm engineered substrates
Proceedings paper2019, 7th Workshop on Wide Bandgap Power Devices and Applications - WIPDA 2019, 29/10/2019, p.292-296Publication A comprehensive study of MOVPE growth on 200 mm GaN-on-SOI for monolithic integrated GaN ICs
Meeting abstract2021, 2021 Virtual MRS Spring Meeting, 17/04/2021Publication An E-mode p-GaN HEMT monolithically-integrated three-level gate driver operating with a single voltage supply
Journal article2021, IEICE ELECTRONICS EXPRESS, (18) 6, p.20210059Publication Analysis of the drain-to-substrate leakage of power HEMTs grown on highly resistive silicon substrate
Proceedings paper2018, GaN Marathon 2.0, 18/04/2018, p.38-39Publication Buffer vertical leakage mechanism and reliability of 200-mm GaN-on-SOI
Journal article2019, IEEE Transactions on Electron Devices, (66) 1, p.553-536Publication CMOS process-compatible 200mm polycrystalline AlN substrates for GaN power transistors
Proceedings paper2017, Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 21/05/2017, p.97-98Publication Demonstration of GaN integrated half-bridge with on-chip drivers on 200-mm engineered substrates
Journal article2019, IEEE Electron Device Letters, (40) 9, p.1499-1502Publication Epitaxial growth by MOCVD on 200 mm engineered substrates for power devices & ICs beyond 650 V
Meeting abstract2019, DGKK Workshop "Epitaxy of III-V Semiconductors", 5/12/2019Publication Evaluation of novel carrier substrates for high reliability and integrated GaN devices in a 200 mm complementary metal-oxide semiconductor compatible process
Journal article2018, MRS Communications, 84, p.1387-1394Publication GaN Device architectures enabled by next generation substrates
Proceedings paper2018, GaN Marathon 2.0, 18/04/2018, p.27-28Publication GaN power IC design using the MIT virtual source GaNFET compact model with gate leakage and V-T instability effect
Journal article2021, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, (36) 3, p.035008Publication GaN-on-SOI: Monolithically integrated all GaN ICs for power conversion
; ; ; ; ;Guo, Weiming; Proceedings paper2019, IEEE International Electron Devices Meeting - IEDM, 7/12/2019, p.78-81Publication Impact of crystal orientation on ohmic contact resistance of enhancement-mode pGaN gate high electron mobility transistors on 200 mm Si substrates
Journal article2018, Japanese Journal of Applied Physics, 57, p.04FG02-1-04FG02-4Publication Impact of substrate resistivity on the vertical leakage, breakdown, and trapping in GaN-on-Si E-Mode HEMTs
Journal article2018, IEEE Transactions on Electron Devices, (65) 7, p.2765-2770Publication Impact of the substrate and buffer design on the performance of GaN on Si
Journal article2018, Microelectronics Reliability, (88) 90, p.584-588Publication Influence of driver integration on GaN enhancement mode transistor performance
Proceedings paper2020, 21st IEEE Workshop on Control and Modeling for Power Electronics - COMPEL, 9/11/2020Publication Influence of Driver Integration on GaN Enhancement Mode Transistor Performance
Proceedings paper2020, IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), NOV 09-12, 2020, p.480-485