Browsing by Author "Richard, Emmanuel"
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Publication A grain size limitation inherent to electroplated copper films
Proceedings paper2000, Proceedings of the IEEE International Interconnect Technology Conference - IITC, 5/06/2000, p.31-33Publication Advanced solutions for copper and low k technology
Oral presentation2000, Semicon Europe; 2000; München, Germany.Publication Critical issues in the integration of Copper and low-k dielectrics
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.262-264Publication Integration of electroless and electrolytic Cu and IC back end of line technologies
Proceedings paper2000, Electrochemical Technology Applications in Electronics III, 17/10/1999, p.71-79Publication Integration of electroless and electrolytic Cu in the IC back end line of technologies
Meeting abstract1999, 196th Meeting of the Electrochemical Society: 3rd Int. Symposium on Electrochemical Technology Applications in Electronics, 17/10/1999, p.903Publication Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Oral presentation2000, Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.Publication Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.290-292Publication Rapid thermal anealing of electro chemically plated Cu films
Proceedings paper2000, Advanced Metallization Conference 1999 - AMC 1999, 28/09/1999, p.167-171Publication Rapid thermal annealing of electro chemically plated Cu films
Oral presentation1999, Advanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.Publication Roles of additive during filling process of damascene structures with electrochemical deposited copper
Oral presentation1999, Advanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.Publication Roles of additives during filling process of damascene structures with electrochemical deposited copper
Proceedings paper2000, Advanced Metallization Conference 1999 - AMC 1999, 28/09/1999, p.149-153Publication Self-annealing characterization of electroplated copper films
Journal article2000, Microelectronic Engineering, (50) 1_4, p.449-457Publication Self-annealing characterization of electroplated copper films
Oral presentation1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.Publication Stress and impurities in electroplated copper
Proceedings paper2001, Advanced Metallization Conference 2000, 3/10/2000, p.161-165Publication Stress in electrochemically deposited copper
Proceedings paper1999, Stress Induced Phenomena in Metallization: 5th International Workshop, 23/06/1999, p.249-254Publication Two-step room temperature grain growth in electroplated copper
Journal article1999, J. Appl. Phys., (86) 7, p.3642-3645