Browsing by Author "Schuhmacher, Jorg"

A novel approach to characterise a low-k dielectric polymer surface

A novel approach to characterization of a low-k dielectric polymer surface

A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

Atomic layer deposited barriers for copper interconnects

Atomic-layer deposited barrier and seed layers for interconnects

Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects

Barrier reliability on sub-100nm copper low-k interconnects

Characterization of ALD diffusion barrier on low-k dielectric polymer by contact angle measurements

Characterization of the growth of atomic layer deposited WNxCy films on various substrates

Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers

Corrosion and inhibition of WNxCy barrier during chemical mechanical planarization

Effect of plasma treatments on a low-k dielectric polymer surface

Growth and characterization of atomic layer deposited WC0.7N0.3 on polymer films

Growth and characterization of atomic layer deposited WCxNy

Implementation of atomic layer deposition in advanced semiconductor processes

Inhibition of galvanic corrosion of WNC barrier metal for reliable Cu CMP

Initial growth mechanism of atomic layer deposited TiN

Interface characterization of nanoscale laminate structures on dense dielectric substrates by X-ray reflectivity

Interface characterization of nanoscale laminate structures on dense dielectric substrates by x-ray reflectivity

Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure