Browsing by Author "Waeterloos, Joost"
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Publication A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.147-151Publication Barrier process development for damascene integration of porous SiLK resin films
Proceedings paper2002, Advanced Metallization Conference 2001, 9/10/2001, p.307-311Publication Barrier studies on porous silk semiconductor dielectric
Journal article2003, Microelectronic Engineering, (70) 2_4, p.352-357Publication Characterization and integration of low permittivity dielectrics
Waeterloos, JoostPHD thesis1999-06Publication Characterization and process integration of a low-k spin-on dielectric
Publication Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin
Publication Damascene integration feasability of porous SiLK resin films
Proceedings paper2002, Advanced Metallization Conference 2001, 9/10/2001, p.19-24Publication Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.59-61Publication Growth and characterization of atomic layer deposited WC0.7N0.3 on polymer films
Publication Increasing DOF for VIA lithography using a non-CMP based architecture
Proceedings paper1997, Proceedings Interface '97 Microlithography Symposium;, p.249-257Publication Integrating a hydrogen silsesquioxane spin-on dielectric in a quarter micron technology
Proceedings paper1997, 3rd International Dielectrics for ULSI Multilevel Interconnection Conference - DUMIC, 10/02/1997, p.310-316Publication Integration feasibility of porous SiLK semiconductor dielectric
; ; Publication Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
Publication Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure
Proceedings paper1999, Advanced Metallization Conference in 1998 - AMC 1998, 6/10/1998, p.491-497Publication Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Proceedings paper1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference - IITC, 1/06/1998, p.45-47Publication Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Oral presentation1998, Advanced Metallization ConferencePublication Low-k organic spin-on materials in a non-etchback interconnect strategy
Proceedings paper1996, 2nd International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference - DUMIC, 20/02/1996, p.52-59Publication Mechanical analysis of a SiLK/Cu dual damascene interconnect system
Proceedings paper2001, Advanced Metallization Conference 2000, 3/10/2000, p.469-473Publication Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables
Proceedings paper1997, Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, 1/10/1996, p.525-530Publication Post patterning meso porosity creation: a potential solution for pore sealing
Proceedings paper2003, International Interconnect Technology Conference, 2/06/2003, p.242-244