Browsing by Author "Wen, Liang Gong"

Alternative metals for advanced interconnects

Alternative metals for advanced interconnects

Alternative metals for advanced interconnects

Atomic layer deposition of ruthenium for advanced interconnect applications

Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper

Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials

Direct etched Cu characterization for advanced interconnects

Growth evolution and characterization of ultrathin CoGe2 films synthesized via catalytic solid-vapor reaction technique

Integration aspects of post-porosity low-k protection using PMMA sacrificial filler

Integration of porous low-k dielectrics using post porosity pore protection

Low temperature catalytic chemical vapour synthesis of Cu3Ge thin films for interconnect applications

Low temperature chemical vapour synthesis of Cu3Ge thin films for interconnect applications

On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control

Reliability study on cobalt and ruthenium as alternative metals for advance interconnects

Ruthenium metallization for advanced interconnects

Ruthenium nanowires by selective atomic layer deposition

Scaling of Back End of Line Processing : opportunities and challenges

Self-organized organic/inorganic films functional to next generation metallization schemes

The effects of scaling on back end of line processing

Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etching