Browsing by Author "Zhang, Boyao"
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Publication Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding
Publication Exploring Bonding Mechanism of SiCN for Hybrid Bonding
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1953-1957Publication High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications
; ; ; ; ; Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications
Proceedings paper2024, 13th IEEE CPMT Symposium Japan, NOV 13-15, 2024, p.92-95Publication New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding
; ; ; ; ; Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.109-113Publication RF modelling and characterization of TSVs and inductive links of hybrid bonded devices
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.754-759Publication Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch
; ; ; ; ; Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.312-318Publication Scatterometry Application on Cu/SiCN surface topography towards high volume manufacturing
; ; ; Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication Simulation of Bulge-Out Mechanism Enabling Sub-0.5 μm Scaling of Hybrid Wafer-to-Wafer Bonding
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1853-1858Publication Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Journal article2022, MICROELECTRONICS RELIABILITY, 138, p.114716