Browsing by Author "de Marneffe, Jean-Francois"

28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow

2D TMDC aging: a case study of monolayer WS2 and mitigation strategies

30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning

30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning

A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography

A DC-pulsed capacitively-coupled planar Langmuir probe for plasma process diagnostics and monitoring

A metal hardmask approach for the contact patterning of a 0.186 μm² SRAM cell exposed with EUV lithography

A novel low temperature etch approach to reduce ULK plasma damage

A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

A Novel Volatile Film for Dielectric Plasma Damage Protection

A route towards the fabrication of 2D heterostructures using atomic layer etching combined with selective conversion

Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)

Adsorption isobars of fluorocarbon compounds selected for cryogenic etching of low-k materials

Advanced CMOS manufacturing, a drive for plasma science and technology

Advanced etching for nanodevices and 2D materials

Advances and challenges in ultra low-k patterning

Alternative integration of ultra low-k dielectrics by template replacement approach

An experimental study of VUV plasma damage on porous organo-silicon glass materials

Anisotropic properties of Bi-2201 thin films grown on vicinal substrates

Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing