Browsing by author "Li, Yunlong"
Now showing items 1-20 of 104
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A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
A Thin-Film Pinned-Photodiode Imager Pixel with Fully Monolithic Fabrication and beyond 1Me-Full Well Capacity
Kim, Joo Hyoung; Berghmans, François; Siddik, Abu Bakar; Sutcu, Irem; Pintor Monroy, Isabel; Yu, Jehyeok; Weydts, Tristan; Georgitzikis, Epimitheas; Kang, Jubin; Baines, Yannick; Hermans, Yannick; Chandrasekaran, Naresh; De Roose, Florian; Uytterhoeven, Griet; Puybaret, Renaud; Li, Yunlong; Lieberman, Itai; Karve, Gauri; Cheyns, David; Genoe, Jan; Malinowski, Pawel; Heremans, Paul; Myny, Kris; Papadopoulos, Nikolas; Lee, Jiwon (2023) -
Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
Guo, Bin; Wen, Lianggong; Helin, Philippe; Claes, Gert; Verbist, Agnes; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; De Wolf, Ingrid; Shahar, Abdul Hadi; Li, Yunlong; Cui, Hushan; Lux, Marcel; Vereecke, Guy; Tilmans, Harrie; Haspeslagh, Luc; Decoutere, Stefaan; Osman, Haris; Puers, Bob; Severi, Simone; Witvrouw, Ann (2011) -
Active-lite interposer for 2.5 & 3D integration
Hellings, Geert; Scholz, Mirko; Detalle, Mikael; Velenis, Dimitrios; de Potter de ten Broeck, Muriel; Roda Neve, Cesar; Li, Yunlong; Van Huylenbroeck, Stefaan; Chen, Shih-Hung; Marinissen, Erik Jan; La Manna, Antonio; Van der Plas, Geert; Linten, Dimitri; Beyne, Eric; Thean, Aaron (2015) -
Advanced interconnect technology and reliability
Li, Yunlong; Chao, Zhao (2018-04) -
Advanced metallization scheme for 3×50μm via middle TSV and beyond
Van Huylenbroeck, Stefaan; Li, Yunlong; Heylen, Nancy; Croes, Kristof; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Gopinath, Sanjay; Nalla, Praveen; Thorum, Matthew; Meshram, Prashant; Anjos, Daniela M.; Yu, Jengyi (2015) -
Advanced physical analysis of 3D interconnect
Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012) -
Anomalous C-V inversion in TSV's: The problem and its cure
Stucchi, Michele; De Vos, Joeri; Jourdain, Anne; Li, Yunlong; Van der Plas, Geert; Croes, Kristof; Beyne, Eric (2018) -
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability
Tang, Baojun; Croes, Kristof; Barbarin, Yohan; Wang, Yunqi; Degraeve, Robin; Li, Yunlong; Toledano Luque, Maria; Kauerauf, Thomas; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid (2014) -
Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Li, Yunlong; Tokei, Zsolt; Mandrekar, T.; Mebarki, Bencherki; Groeseneken, Guido; Maex, Karen (2005) -
Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, Thomas; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, B.; Maex, Karen (2005) -
Barrier reliability on sub-100nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, T.; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, Bencherki; Maex, Karen (2004) -
Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Li, Yunlong; Cheyns, David; Moreno Hagelsieb, Luis; Georgitzikis, Epimitheas; Lim, Myung jin; Mao, Ming; Witters, Thomas; Leyssens, Kenny; Boulenc, Pierre; Lee, Jiwon; Malinowski, Pawel; Guerrieri, Stefano (2019) -
Colloidal quantum dot image sensors: a new vision for infrared
Malinowski, Pawel; Pejovic, Vladimir; Georgitzikis, Epimitheas; Kim, Joo Hyoung; Lieberman, Itai; Papadopoulos, Nikolas; Lim, Myung Jin; Moreno Hagelsieb, Luis; Chandrasekaran, Naresh; Puybaret, Renaud; Li, Yunlong; Verschooten, Tom; Thijs, Steven; Cheyns, David; Heremans, Paul; Lee, Jiwon (2022) -
Considering percolation path growth in low-k dielectric TDDB measurements
Wu, Chen; Li, Yunlong; Tokei, Zsolt; Croes, Kristof (2017) -
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi (2016) -
Copper electromigration failure times evaluated over a wide range of voiding phases
Li, Yunlong; Croes, Kristof; Kirimura, Tomoyuki; Siew, Yong Kong; Tokei, Zsolt (2012) -
Correlation between field dependent electrical conduction and dielectric breakdown in a SiOCH based low-k (k=2.0) dielectric
Wu, Chen; Li, Yunlong; Barbarin, Yohan; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; De Wolf, Ingrid; Tokei, Zsolt (2013) -
Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials
Wu, Chen; Li, Yunlong; Lesniewska, Alicja; Varela Pedreira, Olalla; de Marneffe, Jean-Francois; Ciofi, Ivan; Verdonck, Patrick; Baklanov, Mikhaïl; Boemmels, Juergen; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2015) -
Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Li, Yunlong; Heylen, Nancy; Delande, Tinne; Kellens, Kristof; Ong, Patrick; Leunissen, Peter; Tarnowka, Alexandre; Eliyahu, Aviv (2009-03)