Browsing by author "Wang, Teng"
Now showing items 1-20 of 44
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3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
Daily, Robert; Capuz, Giovanni; Wang, Teng; Bex, Pieter; Struyf, Herbert; Sleeckx, Erik; Demeurisse, Caroline; Attard, A.; Eberharter, W.; Klingler, H. (2015) -
3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Hou, Lin; Derakhshandeh, Jaber; De Coster, Jeroen; Wang, Teng; Cherman, Vladimir; Bex, Pieter; Van De Plas, Geert; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
An alternative 3D packaging route thru wafer reconstruction
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015) -
Application of 3D X-ray microscopy for 3D IC process development
Wang, Teng; De Wolf, Ingrid; Gu, Allen; Estrada, Raleigh (2016) -
Automated testing of bare die-to-die stacks
Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-10) -
Automated testing of bare die-to-die stacks
Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-07) -
Automated testing of bare die-to-die stacks
Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-05) -
Automated testing of singulated die-to-die stacks
Thiele, Frank; Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-09) -
Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges
De Vos, Joeri; Cherman, Vladimir; Detalle, Mikael; Wang, Teng; Salahouelhadj, Abdellah; Daily, Robert; Van der Plas, Geert; Beyne, Eric (2014) -
Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills
Duval, Fabrice; Wang, Teng; Capuz, Giovanni; Gerets, Carine; Miller, Andy; Rebibis, Kenneth June; Beyne, Eric (2015) -
Cost components for 3D system integration
Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Cu-Cu insertion bonding technique using photosensitive polymer as WLUF
Potoms, Goedele; Wang, Teng; Derakhshandeh, Jaber; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2014) -
Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2013) -
Development and evaluation of photodefinable wafer level underfill
Mitsukura, Kazuyuki; Saisyo, Ryouta; Makino, Tatsuya; Hatakeyama, Keiichi; Minegishi, Tomonori; Wang, Teng; Daily, Robert; Duval, Fabrice; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2015) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014)