Browsing by author "Vervoort, Iwan"
Now showing items 1-20 of 38
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A grain size limitation inherent to electroplated copper films
Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan; Maex, Karen (2000) -
Advanced solutions for copper and low k technology
Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000) -
Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
Das, Arabinda; Kokubo, Terukazu; Furukawa, Yukiko; Struyf, Herbert; Vos, Ingrid; Sijmus, Bram; Iacopi, Francesca; Van Aelst, Joke; Le, Quoc Toan; Carbonell, Laure; Brongersma, Sywert; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Sleeckx, Erik; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Rosseel, Erik; Van Hove, Marleen; Vanhaelemeersch, Serge; Shiota, A.; Maex, Karen (2002) -
Copper deposition and subsequent grain structure evolution in narrow lines
Brongersma, Sywert; D'Haen, Jan; Vanstreels, Kris; De Ceuninck, Ward; Vervoort, Iwan; Maex, Karen (2003) -
Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Tokei, Zsolt; Demuynck, Steven; Vervoort, Iwan; Mebarki, Bencherki; Mandrekar, T.; Guggilla, S.; Maex, Karen (2003) -
Critical issues in the integration of Copper and low-k dielectrics
Donaton, R. A.; Coenegrachts, Bart; Maex, Karen; Struyf, Herbert; Vanhaelemeersch, Serge; Beyer, Gerald; Richard, Emmanuel; Vervoort, Iwan; Fyen, Wim; Grillaert, Joost; van der Groen, Sonja; Stucchi, Michele; De Roest, David (1999) -
Cu/LKD-5109 damascene integration demonstration using FF-02 low-k spin-on hard-mask and embedded etch-stop
Kokubo, Terukazu; Das, Arabinda; Furukawa, Yukiko; Vos, Ingrid; Iacopi, Francesca; Struyf, Herbert; Van Aelst, Joke; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Bender, Hugo; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Van Hove, Marleen; Vanhaelemeersch, Serge; Peterson, William; Shiota, A.; Maex, Karen (2002) -
Electrical and microstructural characterization of narrow Cu interconnects
Wu, Wen; Brongersma, Sywert; Vervoort, Iwan; Bender, Hugo; Van Hove, Marleen; Maex, Karen (2004) -
Electrical and microstructural characterization of narrow Cu interconnects
Wu, Wen; Brongersma, Sywert; Vervoort, Iwan; Bender, Hugo; Van Hove, Marleen; Maex, Karen (2003) -
Electrochemical deposition of copper alloys
Quoc, Toan Le; Vervoort, Iwan; Conard, Thierry; Maex, Karen (2001) -
Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
Thompson, Heike; Vanhaelemeersch, Serge; Maex, Karen; Van Ammel, Annemie; Beyer, Gerald; Coenegrachts, Bart; Vervoort, Iwan; Waeterloos, Joost; Struyf, Herbert; Palmans, Roger; Forester, Lynn (1999) -
Grain growth in electroplated copper
Brongersma, Sywert; Kerr, Emma; Vervoort, Iwan; Maex, Karen (2001) -
Grain growth, stress, and impurities in electroplated copper
Brongersma, Sywert; Kerr, Emma; Vervoort, Iwan; Saerens, Annelies; Maex, Karen (2002) -
Grain structure evolution during annealing of electroplated copper
Brongersma, Sywert; Kerr, Emma; Vervoort, Iwan; Maex, Karen (2002) -
High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene
Jenei, Snezana; Decoutere, Stefaan; Winderickx, Gillis; Struyf, Herbert; Tokei, Zsolt; Vervoort, Iwan; Vos, I.; Jaenen, Patrick; Carbonell, Laure; De Jaeger, Brice; Donaton, R. A.; Vanhaelemeersch, Serge; Maex, Karen; Nauwelaers, Bart (2001) -
Integration feasibility of porous SiLK semiconductor dielectric
Waeterloos, Joost; Struyf, Herbert; Van Aelst, Joke; Castillo, D. W.; Lucero, S.; Caluwaerts, Rudy; Alaerts, Carine; Mannaert, Geert; Boullart, Werner; Sleeckx, Erik; Schaekers, Marc; Tokei, Zsolt; Vervoort, Iwan; Steenbergen, Johnny; Sijmus, Bram; Vos, I.; Meuris, Marc; Iacopi, Francesca; Donaton, R (2001) -
Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
Waeterloos, Joost; Shaffer, E. O.; Stokich, T.; Hetzner, J.; Price, D.; Booms, L.; Donaton, R. A.; Beyer, Gerald; Coenegrachts, Bart; Caluwaerts, Rudy; Struyf, Herbert; Tokei, Zsolt; Vervoort, Iwan; Sjjmus, B.; Vos, I.; Maex, Karen; Komiya, Takayuki; Iwashita, J. M. (2001) -
Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures
Donaton, R. A.; Coenegrachts, Bart; Maenhoudt, Mireille; Pollentier, Ivan; Struyf, Herbert; Vanhaelemeersch, Serge; Vos, I.; Meuris, Marc; Fyen, Wim; Beyer, Gerald; Tokei, Zsolt; Stucchi, Michele; Vervoort, Iwan; De Roest, David; Maex, Karen (2001) -
Integration of electroless and electrolytic Cu and IC back end of line technologies
Maex, Karen; Brongersma, Sywert; Lantasov, Yuri; Richard, Emmanuel; Palmans, Roger; Vervoort, Iwan (2000) -
Integration of electroless and electrolytic Cu in the IC back end line of technologies
Maex, Karen; Palmans, Roger; Lantasov, Yuri; Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan (1999)