Browsing by author "Kljucar, Luka"
Now showing items 1-20 of 22
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28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV Lithography
Kim, Il Hwan; Kim, Insung; Park, Changmin; Lee, Jsiun; Ryu, Koungmin; De Schepper, P.; Doise, J.; Kocsis, M.; De Simone, Danilo; Kljucar, Luka; Das, Poulomi; Blanc, Romuald; Beral, Christophe; Severi, Joren; Vandenbroeck, Nadia; Foubert, Philippe; Charley, Anne-Laure; Oak, Apoorva; Xu, Dongbo; Gillijns, Werner; Mitard, Jerome; Tokei, Zsolt; van der Veen, Marleen; Heylen, Nancy; Teugels, Lieve; Le, Quoc Toan; Schleicher, Filip; Leray, Philippe; Ronse, Kurt (2021) -
28nm-pitch Ru interconnects patterned with 0.33NA-EUV single exposure
Das, Sayantan; Kisson, Nicola; Mahmud Ul Hasan, Hasan MD; Rynders, Luc; Kljucar, Luka; Halder, Sandip; Leray, Philippe; Dusa, Mircea; Rio, David; Mohsen, Mahmoud; Spence, Chris; De Poortere, Etienne (2021) -
300mm IGZO nFETs with low-T Ru contacts for localized doping and increased BEOL compatibility
Kljucar, Luka; Smets, Quentin; van Setten, Michiel; Mitard, Jerome; Belmonte, Attilio; Dekkers, Harold; Teugels, Lieve; Mao, Ming; Puliyalil, Harinarayanan; del Agua Borniquel, Jose Ignacio; Delhougne, Romain; Sankaran, Kiroubanand; Tokei, Zsolt (2020) -
Capacitor-less, Long-Retention (> 400s) DRAM Cell Paving the Way towards Low-Power and High-Density Monolithic 3D DRAM
Belmonte, Attilio; Oh, Hyungrock; Rassoul, Nouredine; Donadio, Gabriele Luca; Mitard, Jerome; Dekkers, Harold; Delhougne, Romain; Subhechha, Subhali; Vaisman Chasin, Adrian; van Setten, Michiel; Kljucar, Luka; Mao, Ming; Puliyalil, Harinarayanan; Pak, Murat; Teugels, Lieve; Tsvetanova, Diana; Banerjee, Kaustuv; Souriau, Laurent; Tokei, Zsolt; Goux, Ludovic; Kar, Gouri Sankar (2020) -
CMOS area scaling and the need for high aspect ratio vias
Briggs, Basoene; Guissi, Sofiane; Wilson, Chris; Ryckaert, Julien; Paolillo, Sara; Vandersmissen, Kevin; Versluijs, Janko; Lorant, Christophe; Heylen, Nancy; Boemmels, Juergen; Tokei, Zsolt; Sherazi, Yasser; Weckx, Pieter; Kljucar, Luka; van der Veen, Marleen; Boccardi, Guillaume; De Heyn, Vincent; Gupta, Anshul; Ervin, Joseph; Kamon, Matt (2018) -
Cobalt and Ruthenium drift in ultra-thin oxides
Tierno, Davide; Varela Pedreira, Olalla; Wu, Chen; Jourdan, Nicolas; Kljucar, Luka; Tokei, Zsolt; Croes, Kristof (2019) -
Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Sah, Kaushik; Cross, Andrew; Das, Sayantan; Blanco, Victor; Kljucar, Luka; Halder, Sandip; Leray, Philippe (2021) -
Design aspects for CPI robust BEOL
Gonzalez, Mario; Kljucar, Luka; Vandevelde, Bart; De Wolf, Ingrid; Tokei, Zsolt (2014) -
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Kljucar, Luka; Gonzalez, Mario; Vanstreels, Kris; Ivankovic, Andrej; Hecker, Michael; De Wolf, Ingrid (2014) -
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Kljucar, Luka; Gonzalez, Mario; Vanstreels, Kris; Ivankovic, Andrej; Hecker, Michael; De Wolf, Ingrid (2015) -
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line
Kljucar, Luka; Gonzalez, Mario; De Wolf, Ingrid; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016-01) -
IGZO integration scheme for enabling IGZO nFETs
Kljucar, Luka; Mitard, Jerome; Rassoul, Nouredine; Dekkers, Harold; Steudel, Soeren; del Agua Borniquel, Jose Ignacio; De Wachter, Bart; Teugels, Lieve; Tsvetanova, Diana; Devriendt, Katia; Grisin, Ilja; Boccardi, Guillaume; Hody, Hubert; Nag, Manoj; Di Piazza, Luca; Wilson, Chris; Kar, Gouri Sankar; Tokei, Zsolt; Ramalingam, J.; Cao, Yong; Diehl, Daniel L. (2019) -
Impact of surface condition on Cobalt drift into LK3.0 films
Tierno, Davide; Lesniewska, Alicja; Kljucar, Luka; van der Veen, Marleen; Tokei, Zsolt; Croes, Kristof (2020) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Murdoch, Gayle; De Vos, Joeri; Boemmels, Juergen; Beyne, Eric; Tokei, Zsolt (2016) -
Mechanical stability of Cu/low-k BEOL interconnects
Gonzalez, Mario; Vanstreels, Kris; Cherman, Vladimir; Croes, Kristof; Kljucar, Luka; De Wolf, Ingrid; Tokei, Zsolt (2014) -
Methodologies to mitigate package induced stresses in the BEOL
Gonzalez, Mario; Kljucar, Luka; De Vos, Joeri; Beyne, Eric (2016) -
Oxygen Defect Stability in Amorphous, C-Axis Aligned, and Spinel IGZO
van Setten, Michiel; Dekkers, Harold; Kljucar, Luka; Mitard, Jerome; Pashartis, Christopher; Subhechha, Subhali; Rassoul, Nouredine; Delhougne, Romain; Kar, Gouri Sankar; Pourtois, Geoffrey (2021) -
Stress mitigation of 3D-stacking/packaging induced stresses
Croes, Kristof; Cherman, Vladimir; Lofrano, Melina; Zahedmanesh, Houman; Kljucar, Luka; Gonzalez, Mario; De Wolf, Ingrid; Tokei, Zsolt; Beyne, Eric (2018)