Browsing by author "Boullart, Werner"
Now showing items 1-20 of 205
-
15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU
Xu, Kaidong; Souriau, Laurent; Hellin, David; Versluijs, Janko; Wong, Patrick; Vangoidsenhoven, Diziana; Vandenbroeck, Nadia; Dekkers, Harold; Shi, Xiaoping; Albert, Johan; Tan, Chi Lim; Vertommen, Johan; Coenegrachts, Bart; Orain, I.; Kimura, Y.; Wiaux, Vincent; Boullart, Werner (2013) -
15nm HP patterning with EUV lithography and SADP
Souriau, Laurent; Hellin, David; Kunnen, Eddy; Versluijs, Janko; Dekkers, Harold; Albert, Johan; Orain, Isabelle; Yoshie, Kimura; Xu, Kaidong; Vertommen, Johan; Wiaux, Vincent; Boullart, Werner (2012) -
45nm nMOSFET with metal gate on thin SiON driving 1150μA/μm and off-state of 10nA/μm
Henson, Kirklen; Lander, Rob; Demand, Marc; Dachs, Charles; Kaczer, Ben; Deweerd, Wim; Schram, Tom; Tokei, Zsolt; Hooker, Jacob; Cubaynes, Florence; Beckx, Stephan; Boullart, Werner; Coenegrachts, Bart; Vertommen, Johan; Richard, Olivier; Bender, Hugo; Vandervorst, Wilfried; Kaiser, M.; Everaert, Jean-Luc; Jurczak, Gosia; Biesemans, Serge (2004) -
A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12) -
A DC-pulsed capacitively-coupled planar Langmuir probe for plasma process diagnostics and monitoring
Samara, Vladimir; Booth, Jean-Paul; de Marneffe, Jean-Francois; Milenin, Alexey; Brouri, Mohand; Boullart, Werner (2012) -
A descum review for cleaning surfaces in polymer embedded process flows
Jamieson, Geraldine; Iker, Francois; Takeshi, Kita; Duval, Fabrice; Pham, Nga; Gerets, Carine; Boullart, Werner; Funaya, T. (2010) -
A low cost 90nm RF-CMOS platform for record RF circuit performance
Jeamsaksiri, Wutthinan; Linten, Dimitri; Thijs, Steven; Carchon, Geert; Ramos, Javier; Mercha, Abdelkarim; Sun, Xiao; Soussan, Philippe; Dehan, Morin; Chiarella, Thomas; Venegas, Rafael; Subramanian, Vaidy; Scholten, A.; Wambacq, Piet; Velghe, Rudolf; Mannaert, Geert; Heylen, Nancy; Verbeeck, Rita; Boullart, Werner; Heyvaert, Ilse; Mahadeva Iyer, Natarajan; Groeseneken, Guido; Debusschere, Ingrid; Biesemans, Serge; Decoutere, Stefaan (2005-06) -
A new scaling issue in the electrical behavior of damascene versus plasma-etched interconnects
Proost, Joris; Conard, Thierry; Boullart, Werner; Grillaert, Joost; Maex, Karen (1998) -
A novel concept for contact etch residue removal
Vos, Ingrid; Hellin, David; Demuynck, Steven; Richard, Olivier; Conard, Thierry; Vertommen, Johan; Boullart, Werner (2007) -
A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007) -
A plasma etch process for bulk finFET manufacturing
Shamiryan, Denis; Redolfi, Augusto; Boullart, Werner (2007-10) -
Advanced CMOS manufacturing, a drive for plasma science and technology
de Marneffe, Jean-Francois; Altamirano Sanchez, Efrain; Milenin, Alexey; Samara, Vladimir; Boullart, Werner; Baklanov, Mikhaïl (2012) -
Advances and challenges in ultra low-k patterning
Xu, Kaidong; Souriau, Laurent; Lazzarino, Frederic; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Boullart, Werner (2012) -
Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry
Li, H.; Baklanov, Mikhaïl; Boullart, Werner; Conard, Thierry; Brijs, Bert; Maex, Karen; Froyen, L. (1999) -
Back-end, low-k dielectric compatible resist rework procedure
Reybrouck, Mario; Vangoidsenhoven, Diziana; Maenhoudt, Mireille; Van Aelst, Joke; Boullart, Werner (2002) -
C2H4-based plasma-assisted CD shrink and contact patterning for RRAM application
Milenin, Alexey; Lisoni, Judit; Jossart, Nico; Jurczak, Gosia; Struyf, Herbert; Shamiryan, Denis; Brouri, Mohand; Boullart, Werner (2010) -
Challenges for smoothing EUV photoresist line-width-roughness: plasma treatment from 40 to 22 nm half pitches
Altamirano Sanchez, Efrain; De Schepper, Peter; Hansen, Terje; Boullart, Werner (2013) -
Challenges of clean/strip processing for Cu/LowK technology
Baklanov, Mikhaïl; Le, Quoc Toan; Kesters, Els; Iacopi, Francesca; Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Challenges of etching new gate materials for Si device below 45nm node
Boullart, Werner (2008) -
Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
Das, Arabinda; Kokubo, Terukazu; Furukawa, Yukiko; Struyf, Herbert; Vos, Ingrid; Sijmus, Bram; Iacopi, Francesca; Van Aelst, Joke; Le, Quoc Toan; Carbonell, Laure; Brongersma, Sywert; Maenhoudt, Mireille; Tokei, Zsolt; Vervoort, Iwan; Sleeckx, Erik; Stucchi, Michele; Schaekers, Marc; Boullart, Werner; Rosseel, Erik; Van Hove, Marleen; Vanhaelemeersch, Serge; Shiota, A.; Maex, Karen (2002)