Browsing by author "Ivankovic, Andrej"
Now showing items 1-20 of 20
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3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D stacking induced mechanical stress effects
Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2012) -
Copper through silicon via induced keep out zone for 10nm node bulk FinFET CMOS technology
Guo, Wei; Moroz, Victor; Van der Plas, Geert; Choi, M.; Redolfi, Augusto; Smith, L.; Eneman, Geert; Van Huylenbroeck, Stefaan; Su, P.D.; Ivankovic, Andrej; De Wachter, Bart; Debusschere, Ingrid; Croes, Kris; De Wolf, Ingrid; Mercha, Abdelkarim; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013) -
Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips
Wong, C.S.; Ivankovic, Andrej; Cowley, A.; Bennett, N.S.; Danilewsky, A.; Gonzalez, Mario; Cherman, Vladimir; Vandevelde, Bart; De Wolf, Ingrid; McNally, P.J. (2014) -
Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2010) -
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Kljucar, Luka; Gonzalez, Mario; Vanstreels, Kris; Ivankovic, Andrej; Hecker, Michael; De Wolf, Ingrid (2014) -
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Kljucar, Luka; Gonzalez, Mario; Vanstreels, Kris; Ivankovic, Andrej; Hecker, Michael; De Wolf, Ingrid (2015) -
FET arrays as CPI sensors for 3D stacking and packaging characterization
Ivankovic, Andrej; Cherman, Vladimir; Van der Plas, Geert; Vandevelde, Bart; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
IC-package interaction
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: characterisation methods and implementation in FEM
Ivankovic, Andrej; Vanstreels, Kris; Hsu, Yung-Yu; Gonzalez, Mario; Brizar, Guy; Vanderstraeten, Daniel; Blansaer, Eddy; Gillon, Renaud; Defloor, M.; Vandaele, K.; Degryse, D.; Vandevelde, Bart (2011-04) -
Impact of through silicon via induced mechanical stress on fully depleted bulk FinFET technology
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Cherman, Vladimir; Eneman, Geert; De Wachter, Bart; Togo, Mitsuhiro; Redolfi, Augusto; Kubicek, Stefan; Civale, Yann; Chiarella, Thomas; Vandevelde, Bart; Croes, Kristof; De Wolf, Ingrid; Debusschere, Ingrid; Mercha, Abdelkarim; Thean, Aaron; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Reliability concerns in copper TSV's: methods and results
Croes, Kristof; Cherman, Vladimir; Li, Yunlong; Zhao, Larry; Barbarin, Yohan; De Messemaeker, Joke; Civale, Yann; Velenis, Dimitrios; Stucchi, Michele; Kauerauf, Thomas; Redolfi, Augusto; Dimcic, Biljana; Ivankovic, Andrej; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012-07) -
The underfill-microbump interaction mechanism in 3D ICs: impact and mitigation of induced stresses
Ivankovic, Andrej; Cherman, Vladimir; Gonzalez, Mario; Vandevelde, Bart; Vandepitte, Dirk; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2014) -
Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits
Ivankovic, Andrej; Cherman, Vladimir; Vandevelde, Bart; Van der Plas, Geert; Rebibis, Kenneth June; La Manna, Antonio; Beyne, Eric; De Wolf, Ingrid; Vandepitte, Dirk (2011)