Browsing by author "Vereecke, Guy"

300 mm wafer development for pattern collapse evaluations

Xu, XiuMei; Tao, Zheng; Saib, Mohamed; Sebaai, Farid; Van de Kerkhove, Jeroen; Vrancken, Nandi; Vereecke, Guy; Holsteyns, Frank (2018)

A force study in brush scrubbing

Xu, Kaidong; Vos, Rita; Vereecke, Guy; Doumen, Geert; Fyen, Wim; Mertens, Paul; Heyns, Marc; Vinckier, Chris; Fransaer, Jan (2005)

A force study in brush scrubbing

Xu, Kaidong; Vos, Rita; Vereecke, Guy; Doumen, Geert; Mertens, Paul; Heyns, Marc (2004)

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007)

A perspective on dry laser cleaning for semiconductor manufacturing

Vereecke, Guy; Röhr, Erika; Van Hoeymissen, Jan; Mertens, Paul; Heyns, Marc (2001)

A study in interactions of plasmas and wet cleans with ULK materials

Xu, Kaidong; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Lux, Marcel; Kraus, Harald; Henry, Sally - Ann; Archer, L.; Gaulhofer, E.; Kovacs, F.; Dalmer, M.; Mertens, Paul; Luo, S. J; Han, Q. Y (2007)

Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers

Guo, Bin; Wen, Lianggong; Helin, Philippe; Claes, Gert; Verbist, Agnes; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; De Wolf, Ingrid; Shahar, Abdul Hadi; Li, Yunlong; Cui, Hushan; Lux, Marcel; Vereecke, Guy; Tilmans, Harrie; Haspeslagh, Luc; Decoutere, Stefaan; Osman, Haris; Puers, Bob; Severi, Simone; Witvrouw, Ann (2011)

Acoustic cleaning in nano-electronics

Mertens, Paul; Janssens, Tom; Holsteyns, Frank; Zijlstra, Aaldert; Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Hoyer, Ronald; Barbagini, Francesca; Wada, Masayuki; Franklin, Cole; Kim, Tae-Gon; Kim, K; Kenis, Karine; Le, Quoc Toan; Claes, Martine; Kesters, Els; Vos, Rita; Vereecke, Guy; Bearda, Twan; Heyns, Marc (2008)

Advanced wafer surface cleaning technology

Mertens, Paul; Vos, Rita; Vereecke, Guy; Arnauts, Sophia; Bearda, Twan; De Waele, Rita; Eitoku, Atsuro; Fyen, Wim; Geckiere, J.; Hellin, David; Holsteyns, Frank; Kesters, Els; Claes, Martine; Kenis, Karine; Kraus, Harald; Malhouitre, Stephane; Lee, Kuntack; Kocsis, Michael; Onsia, Bart; Garaud, Sylvain; Rip, Jens; Snow, Jim; Teerlinck, I.; Van Hoeymissen, Jan; Barbagini, Francesca; Xu, Kaidong; Paraschiv, Vasile; De Gendt, Stefan; Mannaert, Geert; Heyns, Marc (2004)

Aging phenomena in the removal of nano-particles from Si wafers

Vereecke, Guy; Veltens, J.; Xu, Kaidong; Eitoku, A.; Sano, Ken-Ichi; Arnauts, Sophia; Kenis, Karine; Snow, J.; Vinckier, Chris; Mertens, Paul (2008)

All wet strip approaches for post-etch photoresist layers after low-k patterning

Claes, Martine; Le, Quoc Toan; Kesters, Els; Lux, Marcel; Urionabarrenetxea, Ainara; Vereecke, Guy; Mertens, Paul; Carleer, R.; Adriaensens, P. (2007)

All-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures

Le, Quoc Toan; Demuynck, Steven; Suhard, Samuel; Klipp, Andreas; Vereecke, Bart; Vereecke, Guy (2010)