Browsing by author "Urbanowicz, Adam"
Now showing items 1-20 of 44
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Advanced nanoporous functional layer materials with extremely low dielectric constant
Miller, Miroslaw; Urbanowicz, Adam; Broczkowska, Katarzyna (2010) -
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
Mertens, Paul; Kim, Tae-Gon; Claes, Martine; Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Suhard, Samuel; Pacco, Antoine; Lux, Marcel; Kenis, Karine; Urbanowicz, Adam; Tokei, Zsolt; Beyer, Gerald (2009) -
Challenges of plasma damage of low-k materials
Baklanov, Mikhaïl; Urbanowicz, Adam; Vanhaelemeersch, Serge (2007) -
Changes of UV optical properties of plasma damaged low-k dielectrics for sidewall damage scatterometry
Marsik, Premysl; Urbanowicz, Adam; Vinokur, Klara; Cohen, Yoel; Baklanov, Mikhaïl (2008) -
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment
Urbanowicz, Adam; Baklanov, Mikhaïl; Heijlen, Jeroen; Travaly, Youssef; Cockburn, Andrew (2007) -
Effect of energetic ions on plasma damage of SiCOH low-k material
Kunnen, Eddy; Urbanowicz, Adam; Franquet, Alexis; Shamiryan, Denis; Struyf, Herbert; Boullart, Werner; Baklanov, Mikhaïl (2009) -
Effect of energetic ions on plasma damage of SiCOH low-k material
Kunnen, Eddy; Baklanov, Mikhaïl; Franquet, Alexis; Shamiryan, Denis; Rakhimova, Tatyana; Urbanowicz, Adam; Struyf, Herbert; Boullart, Werner (2010) -
Effect of helium plasma on low-k damage during dry resist strip
Urbanowicz, Adam; Shamiryan, Denis; Kim, Dongchan; Baklanov, Mikhaïl (2007) -
Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low-k materials
Urbanowicz, Adam; Vanstreels, Kris; Shamiryan, Denis; De Gendt, Stefan; Baklanov, Mikhaïl (2009) -
Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance
Marsik, Premysl; Urbanowicz, Adam; Verdonck, Patrick; De Roest, David; Sprey, Hessel; Baklanov, Mikhaïl (2011) -
Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultra-low-k PECVD dielectrics
Urbanowicz, Adam; Vanstreels, Kris; Verdonck, Patrick; Van Besien, Els; Trompoukis, Christos; Shamiryan, Denis; De Gendt, Stefan; Baklanov, Mikhaïl (2011) -
Effect of UV-wavelength on hardening process of porogen-containing and porogen-free ultra-low-k PECVD glasses
Urbanowicz, Adam; Vanstreels, Kris; Verdonck, Patrick; Van Besien, Els; Trompoukis, Christos; Shamiryan, Denis; De Gendt, Stefan; Baklanov, Mikhaïl (2010) -
Effects of bias, pressure and temperature in plasma damage of ultra low-k films
Urbanowicz, Adam; Humbert, Aurelie; Mannaert, Geert; Tokei, Zsolt; Baklanov, Mikhaïl (2008) -
Effects of He plasma pre-treatment on low-k damage during post Cu surface ceaning with NH3 plasma
Urbanowicz, Adam; Shamiryan, Denis; Zaka, Alban; Verdonck, Patrick; De Gendt, Stefan; Baklanov, Mikhaïl (2010) -
Effects of plasma chemistry on low-k film properties
Kim, Dongchan; Urbanowicz, Adam; Mannaert, Geert; Struyf, Herbert; Min, K. J.; Kang, C. J.; Moon, J. T.; Baklanov, Mikhaïl (2007) -
Engineering of chemical and physical properties of low-k materials by different wavelength of UV light
Baklanov, Mikhaïl; Marsik, Premysl; Verdonck, Patrick; Ferchichi, Abdelkarim; Urbanowicz, Adam; Prager, L.; De Roest, D.; Mechri, C. (2008) -
Evaluation of plasma damage in patterned low-k structures by near-field scanning probe microwave microscope: effect of plasma ash chemistry
Urbanowicz, Adam; Talanov, Vladimir; Pantouvaki, Marianna; Struyf, Herbert; De Gendt, Stefan; Baklanov, Mikhaïl (2009) -
Fabrication of porogen residue free ultra low-k PECVD material by subsequent H2-afterglow plasma treatment and UV curing
Urbanowicz, Adam; Vanstreels, Kris; Verdonck, Patrick; Shamiryan, Denis; Cremel, Maxime; De Gendt, Stefan; Baklanov, Mikhaïl (2010) -
Fullerene based materials for ultra-low-k application
Broczkowska, Katarzyna; Klocek, Jolanta; Friedrich, Daniel; Kolanek, Krzysztof; Urbanowicz, Adam; Scheisser, Dieter; Miller, Miroslaw; Zschech, Ehrenfried (2010) -
Improved low-k dielectric properties using He/H2 plasma for resist removal
Urbanowicz, Adam; Shamiryan, Denis; Marsik, Premysl; Travaly, Youssef; Verdonck, Patrick; Vanstreels, Kris; Ferchichi, Abdelkarim; De Roest, David; Sprey, Hessel; Matsushita, K.; Kaneko, S.; Tsuji, N.; Luo, S.; Escorcia, O.; Berry, Ivan; Waldfried, Carlo; De Gendt, Stefan; Baklanov, Mikhaïl (2008)