Browsing by imec author "a51a962e3317d6a3af137ed342ed22d602aca54a"
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Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu; Shingubara, Shoso (2014) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric (2017) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Direct bonding of low temperature heterogeneous dielectrics
Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Double-gate Si junction-less n-type transistor for high performance Cu-BEOL compatible applications using 3D sequential integration
Vandooren, Anne; Witters, Liesbeth; Vecchio, Emma; Kunnen, Eddy; Hellings, Geert; Peng, Lan; Inoue, Fumihiro; Li, Waikin; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2017) -
Edge shape control for bonded wafer
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2017) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming for wafer-to-wafer 3D integration
Inoue, Fumihiro; Visker, Jakob; Jourdain, Anne; Moeller, Berthold; Yokoyama, Kaori; Peng, Lan; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Edge trimming induced defects on direct bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2018) -
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Park, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung (2022) -
Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020) -
Electrodeposition for die-to-wafer very high-density interconnect
Inoue, Fumihiro (2020) -
Electrodeposition of Indium for Low Temperature 3D Stacking
Inoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung (2021) -
Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Electroless Cu seed on Ru and Co liners in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Van Huylenbroeck, Stefaan; van der Veen, Marleen; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014) -
Enabling pre-sssembly process of 3D wafers with high topography at the backside
Podpod, Arnita; Demeurisse, Caroline; Inoue, Fumihiro; Duval, Fabrice; Visker, Jakob; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019)