Browsing by author "Jourdan, Nicolas"
Now showing items 41-60 of 60
-
On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control
Tokei, Zsolt; Ciofi, Ivan; Roussel, Philippe; Debacker, Peter; Raghavan, Praveen; van der Veen, Marleen; Jourdan, Nicolas; Wilson, Chris; Vega Gonzalez, Victor; Adelmann, Christoph; Wen, Liang Gong; Croes, Kristof; Varela Pedreira, Olalla; Moors, Kristof; Krishtab, Mikhail; Armini, Silvia; Boemmels, Juergen (2016) -
Plasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application
Jourdan, Nicolas; Barbarin, Yohan; Croes, Kristof; Siew, Yong Kong; Van Elshocht, Sven; Tokei, Zsolt; Vancoille, Eric (2013) -
Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations
Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Reliability study on cobalt and ruthenium as alternative metals for advance interconnects
Varela Pedreira, Olalla; Croes, Kristof; Lesniewska, Alicja; Wu, Chen; van der Veen, Marleen; De Messemaeker, Joke; Vandersmissen, Kevin; Jourdan, Nicolas; Wen, Liang Gong; Adelmann, Christoph; Briggs, Basoene; Vega Gonzalez, Victor; Boemmels, Juergen; Tokei, Zsolt (2017) -
Ru as an alternative material for advanced contacts
Hosseini, Maryam; Schaekers, Marc; van der Veen, Marleen; Teugels, Lieve; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Yu, Hao; Jourdan, Nicolas; Schleicher, Filip; Debruyn, Haroen; Vanstreels, Kris; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Ruthenium recess for buried power rail integration
Gupta, Anshul; Grzeskowiak, Jodi; Jourdan, Nicolas; Yu, Kai-Hung; Joy, Nicolas; Kundu, Shreya; Teugels, Lieve; Boemmels, Juergen; Adelmann, Christoph; Heylen, Nancy; Jamieson, Geraldine; Smith, Jeffrey; Raley, Angelique; deVilliers, Anton; Biesemans, Serge; Wilson, Chris; Leusink, Gert; Tokei, Zsolt (2019) -
Scaled TaN barriers for Cu interconnects: reliability performance
Varela Pedreira, Olalla; Lesniewska, Alicja; Jourdan, Nicolas; Vega Gonzalez, Victor; Lariviere, Stephane; van der Veen, Marleen; Croes, Kristof; Tokei, Zsolt (2019) -
Selective ALD Mo Deposition in 10nm Contacts
van der Veen, Marleen; Maes, J. W.; Varela Pedreira, Olalla; Zhu, C.; Tierno, Davide; Datta, S.; Jourdan, Nicolas; Decoster, Stefan; Wu, Chen; Mousa, M.; Byun, Y.; Struyf, Herbert; Park, Seongho; Tokei, Zsolt (2023) -
Self-organized organic/inorganic films functional to next generation metallization schemes
Armini, Silvia; Carnevali, Guido; Sun, Yiting; Zhang, Liping; de Marneffe, Jean-Francois; Zhang, Yu; Baklanov, Mikhaïl; Jourdan, Nicolas; Verdonck, Patrick; Teugels, Lieve; Delande, Tinne; Wen, Liang Gong; Struyf, Herbert; Boemmels, Juergen; Tokei, Zsolt (2014) -
Semi-empirical interconnect resistance model for advanced technology nodes
Roussel, Philippe; Ciofi, Ivan; Degraeve, Robin; Vega Gonzalez, Victor; Jourdan, Nicolas; Baert, Rogier; Linten, Dimitri; Boemmels, Juergen; Tokei, Zsolt; Groeseneken, Guido; Thean, Aaron (2016) -
Small pitch, high aspect ratio via-last TSV module
Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric (2016) -
Study of chemical vapor deposition of manganese on porous SiCOH low-k dielectrics using Bis(ethylcyclopentadienyl)manganese
Jourdan, Nicolas; Krishtab, Mikhail; Baklanov, Mikhaïl; Meersschaut, Johan; Wilson, Chris; Ablett, J.; Fonda, E.; Zhao, Larry; Van Elshocht, Sven; Tokei, Zsolt; Vancoille, Eric (2012) -
Study of deposition behavior of thermal/plasma-enhanced chemical vapor deposition (CVD/PECVD) of manganese on porous SiCOH low-k dielectric materials for copper diffusion barrier application in advanced interconnect technology
Jourdan, Nicolas; Baklanov, Mikhaïl; Meersschaut, Johan; Vereecke, Guy; Conard, Thierry; Wilson, Chris; Ablett, James; Fonda, Emiliano; Geypen, Jef; Siew, Yong Kong; Van Elshocht, Sven; Tokei, Zsolt (2012) -
Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020) -
Testing the limits of TaN barrier scaling
Witt, Christian; Yeap, K.B.; Lesniewska, Alicja; Wan, Danny; Jourdan, Nicolas; Ciofi, Ivan; Wu, Chen; Tokei, Zsolt (2018) -
Texture control for Cu hybrid bonding pads using a PVD Cu process
De Messemaeker, Joke; Jourdan, Nicolas; Nolmans, Philip; Kim, Soon-Wook; Beyer, Gerald (2019) -
Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node
Vega Gonzalez, Victor; Wilson, Chris; Briggs, Basoene; Decoster, Stefan; Versluijs, Janko; Lesniewska, Alicja; Paolillo, Sara; Baert, Rogier; Puliyalil, Harinarayanan; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Teugels, Lieve; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Gupta, Anshul; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Debacker, Peter; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Dillemans, Leander; Chen, Yi-Fan; Tokei, Zsolt (2019) -
Through-silicon via technology for three-dimensional integrated circuit manufacturing
Civale, Yann; Redolfi, Augusto; Jaenen, Patrick; Kostermans, Maarten; Van Besien, Els; Mertens, Sofie; Witters, Thomas; Jourdan, Nicolas; Armini, Silvia; Vandersmissen, Kevin; Philipsen, Harold; Verdonck, Patrick; Heylen, Nancy; Nolmans, Philip; Li, Yunlong; Croes, Kristof; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Trends in scaling the Cu metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Vandersmissen, Kevin; Wilson, Chris; Varela Pedreira, Olalla; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2017) -
UV nanosecond laser annealing for Ru interconnects
Jourdan, Nicolas; Roze, Fabien; Tabata, Toshiyuki; Lariviere, Stephane; Contino, Antonino; Mazzamuto, Fulvio; Tokei, Zsolt (2020)