Browsing by author "Jourdan, Nicolas"
Now showing items 21-40 of 60
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Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
DTCO and TCAD for a 12 layer-EUV ultra-scaled surrounding gate transistor 6T-SRAM
Matagne, Philippe; Nakamura, H.; Kim, Min-Soo; Kikuchi, Yoshiaki; Huynh Bao, Trong; Tao, Zheng; Li, Waikin; Devriendt, Katia; Ragnarsson, Lars-Ake; Boemmels, Juergen; Mallik, Arindam; Altamirano Sanchez, Efrain; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Porret, Clément; Mocuta, Dan; Harada, N.; Matsuoka, F. (2018) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
Montero Alvarez, Daniel; Vega Gonzalez, Victor; Feurprier, Yannick; Varela Pedreira, Olalla; Oikawa, Noriaki; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Versluijs, Janko; De Coster, Hanne; Bazzazian, Nina; Jourdan, Nicolas; Kumar, Kaushik; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2022-06-29) -
Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability
Armini, Silvia; Lesniewska, Alicja; Jourdan, Nicolas; Delande, Tinne; Vega Gonzalez, Victor; Wilson, Chris; Struyf, Herbert; Tokei, Zsolt (2017) -
Evaluation of metallization options for advanced Cu interconnects application
Jourdan, Nicolas; Carbonell, Laure; Heylen, Nancy; Swerts, Johan; Armini, Silvia; Maestre Caro, Arantxa; Demuynck, Steven; Croes, Kristof; Beyer, Gerald; Tokei, Zsolt; Van Elshocht, Sven; Vancoille, Eric (2011) -
Evaluation of Mn-based Cu barriers for interconnect applications
Van Besien, Els; Jourdan, Nicolas; Zhao, Larry; Croes, Kristof; Siew, Yong Kong; Van Elshocht, Sven; Tokei, Zsolt (2011) -
Exploring W-Cu hybrid dual damascene metallization for future nodes
Lei, W.; Pethe, S.; Hwang, S.; Chen, F.; Wu, Z.; Machillot, J.; Cockburn, A.; Jansen, A.; van der Veen, Marleen; Varela Pedreira, Olalla; Heylen, Nancy; Jourdan, Nicolas; Lariviere, Stephane; Park, Seongho; Struyf, Herbert; Tokei, Zsolt (2021) -
Extending the Cu metallization and alternatives
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Vandersmissen, Kevin; Wilson, Chris; Varela Pedreira, Olalla; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2017) -
FEOL patterning challenges in scaled SRAM with vertical Surrounding Gate Transistors (SGT)
Tao, Zheng; Li, Waikin; Kim, Min-Soo; Devriendt, Katia; Lorant, Christophe; Sebaai, Farid; Porret, Clément; Rosseel, Erik; Sepulveda Marquez, Alfonso; Jourdan, Nicolas; Kikuchi, Yoshiaki; Boemmels, Juergen; Mitard, Jerome; Matagne, Philippe; Ragnarsson, Lars-Ake; Dangol, Anish; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Altamirano Sanchez, Efrain; Lee, James; Li, YiSuo; Kanazawa, Kenichi; Harada, Nozomu; Masuoka, Fujio (2019) -
Hybrid Metallization with Cu in sub 30nm Interconnects
van der Veen, Marleen; Soethoudt, Job; Delabie, Annelies; Varela Pedreira, Olalla; Vega Gonzalez, Victor; Lariviere, Stephane; Teugels, Lieve; Jourdan, Nicolas; Decoster, Stefan; Struyf, Herbert; Wilson, Chris; Croes, Kristof; Tokei, Zsolt (2020) -
Impact of Mn-based barriers on dielectric breakdown voltage and capacitance
Lesniewska, Alicja; Wu, Chen; Jourdan, Nicolas; Briggs, Basoene; Boemmels, Juergen; Tokei, Zsolt; Croes, Kristof (2016) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Interconnects for scaled SRAM with vertical Surrounded Gate Transistors (SGT)
Boemmels, Juergen; Harada, N.; Kim, Min-Soo; Mitard, Jerome; Kikuchi, Yoshiaki; Li, Waikin; Tao, Zheng; Puliyalil, Harinarayanan; Devriendt, Katia; Lorant, Christophe; Le, Quoc Toan; Kesters, Els; Jourdan, Nicolas; El-Mekki, Zaid; Teugels, Lieve; van der Veen, Marleen; Li, Y.; Nakamura, H.; Mocuta, Dan; Masuoka, F. (2019) -
Leakage control in 0.4-nm EOT Ru/SrTiOx/Ru metal-insulator-metal capacitors: process implications
Swerts, Johan; Popovici, Mihaela Ioana; Kaczer, Ben; Aoulaiche, Marc; Redolfi, Augusto; Clima, Sergiu; Caillat, Cristian; Wang, W.C.; Afanasiev, Valeri; Jourdan, Nicolas; Hody, Hubert; Olk, Christina; Van Elshocht, Sven; Jurczak, Gosia (2014) -
Low Energy Ion Scattering (LEIS) analysis of ultra-thin Ru layers on Ta- or Mn-based barriers
Brüner, Philipp; Grehl, T.; Jourdan, Nicolas; Steinbauer, E.; Bauer, P.; Brongersma, H. (2015) -
Microsecond UV laser annealing annihilating Ru grains smaller than electron mean free path
Lu, Lu; Jourdan, Nicolas; Daubriac, Richard; Tabata, Toshiyuki; Roze, Fabien; Thuries, Louis; Cristiano, Fuccio; Tokei, Zsolt (2023) -
N5 technology node dual-damascene interconnects enabled using multi patterning
Briggs, Basoene; Wilson, Chris; Devriendt, Katia; van der Veen, Marleen; Decoster, Stefan; Paolillo, Sara; Versluijs, Janko; Kesters, Els; Sebaai, Farid; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Verdonck, Patrick; Wan, Danny; Varela Pedreira, Olalla; Croes, Kristof; Dutta, Shibesh; Ryckaert, Julien; Mallik, Arindam; Lariviere, Stephane; Boemmels, Juergen; Tokei, Zsolt (2017)