Browsing imec Publications by imec author "c715c48cf342f8f602890c9f3025b1f0c73228d2"
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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023) -
Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; Inoue, Fumihiro; Phommahaxay, Alain; Sleeckx, Erik; De Vos, Joeri; Zinner, Dominik; Thomas, Wagenleitner; Thomas, Uhrmann; Markus, Wimplinger; Ben, Schoenaers; Andre, Stesmans; Afanasiev, Valeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric (2021) -
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; De Gendt, Stefan; Beyer, Gerald; Beyne, Eric (2020) -
Controlled sulfurization process for the synthesis of large area MoS2 films and MoS2-WS2 heterostructures
Chiappe, Daniele; Asselberghs, Inge; Sutar, Surajit; Iacovo, Serena; Afanasiev, Valeri; Stesmans, Andre; Balaji, Yashwanth; Peters, Lisanne; Heyne, Markus; Mannarino, Manuel; Vandervorst, Wilfried; Sayan, Safak; Huyghebaert, Cedric; Caymax, Matty; Heyns, Marc; De Gendt, Stefan; Radu, Iuliana; Thean, Aaron (2016) -
Defect identification in bonding surface layer by positron annihilation spectroscopy
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Nagano, Fuya; Sleeckx, Erik; Beyer, Gerald; Uedono, Akira; Beyne, Eric (2019) -
Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric (2017) -
Direct bonding of low temperature heterogeneous dielectrics
Iacovo, Serena; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Direct Bonding Using Low Temperature SiCN Dielectrics
Iacovo, Serena; Nagano, Fuya; Channam, Venkat Sunil Kumar; Walsby, Edward; Crook, Kath; Buchanan, Keith; Jourdain, Anne; Vanstreels, Kris; Phommahaxay, Alain; Beyne, Eric (2022) -
Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
Phommahaxay, Alain; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Slabbekoorn, John; Inoue, Fumihiro; Peng, Lan; Kennes, Koen; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2019) -
ESD process assessment of 2.5D and 3D bonding technologies
Simicic, Marko; Gijbels, Frank; Iacovo, Serena; Chen, Shih-Hung; Van der Plas, Geert; Beyne, Eric (2023) -
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Bertheau, Julien; Inoue, Fumihiro; Phommahaxay, Alain; Peng, Lan; Iacovo, Serena; Rassoul, Nouredine; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Nakamura, Atsushi (2018) -
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2020) -
Influence of composition of SiCN as interfacial layer on plasma activated direct bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Influence of composition of SiCN for surface activated bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyne, Eric (2018) -
Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Kennes, Koen; Phommahaxay, Alain; Guerrero, Alice; Bauder, Olga; Suhard, Samuel; Bex, Pieter; Iacovo, Serena; Liu, Xiao; Schmidt, Thomas; Beyer, Gerald; Beyne, Eric (2020) -
Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding
Peng, Lan; Kim, Soon-Wook; Iacovo, Serena; De Vos, Joeri; Schoenaers, B.; Stesmans, A.; Afanas'ev, V. V.; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Low temperature SiCN as dielectric for hybrid bonding
Channam, Venkat Sunil Kumar; Iacovo, Serena; Walsby, Edward; Belov, Igor; Jourdain, Anne; Sepulveda Marquez, Alfonso; Beyne, Eric (2023) -
Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
Van Huylenbroeck, Stefaan; De Vos, Joeri; Teugels, Lieve; Iacovo, Serena; Fodor, Ferenc; Miller, Andy; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2021)