Browsing Conference contributions by author "Vaes, Jan"

3D stacked IC demonstration using a through silicon via first approach

Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008)

Advanced production challenges for automated ultra-thin wafer handling

Giesen, Tim; Wertz, Roland; Fischmann, Christian; Kreck, Guido; Govaerts, Jonathan; Vaes, Jan; Debucquoy, Maarten; Verl, Alexander (2012)

CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device

Severi, Simone; Heck, J.; Chou, T.K.A.; Belov, N.; Park, J.S.; Harrar, D.; Jain, A.; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; Varela Pedreira, Olalla; Willegems, Myriam; Vaes, Jan; Jamieson, Geraldine; Haspeslagh, Luc; Adams, D.; Rao, V.; Decoutere, Stefaan; Witvrouw, Ann (2009)

CMP of a RU based layer in an advanced Cu low-k stack

Vaes, Jan; Sinapi, Fabrice; Hernandez, Jose Luis; Santoro, Gaetano; Nguyen, Olivier; Wang, James (2007-10)

CMP processing to enable 3D stacked IC integration

Vaes, Jan; Heylen, Nancy; Van Olmen, Jan; Huyghebaert, Cedric; Leunissen, Peter (2009)

Copper plating for 3D interconnects

Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2009)

Copper plating for 3d interconnects

Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2010)

Crack initiation for kerf-loss-free wafering

Qian, Jun; Kersschot, Bruno; Masolin, Alex; Vaes, Jan; Dross, Frederic; Reynaerts, Dominiek (2011)

Elucidating advanced inhibitor material in copper CMP: K-sorbate as a passivator

Tamir, Magi; Vaes, Jan; Ein Eli, Yair (2008)

Epoxy-induced spalling of silicon

Martini, Roberto; Gonzalez, Mario; Dross, Frederic; Masolin, Alex; Vaes, Jan; Frederickx, Danny; Poortmans, Jef (2012)

Evidence and characterization of crystallographic defect and material quality after SLIM-cut process

Masolin, Alex; Vaes, Jan; Dross, Frederic; Pesquera, Amaia; Poortmans, Jef; Mertens, Robert (2011)

Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration

De Munck, Koen; Vaes, Jan; Bogaerts, Lieve; De Moor, Piet; Van Hoof, Chris; Swinnen, Bart (2007)

Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications

Haspeslagh, Luc; De Coster, Jeroen; Varela Pedreira, Olalla; De Wolf, Ingrid; Du Bois, Bert; Verbist, Agnes; Van Hoof, Rita; Willegems, Myriam; Locorotondo, Sabrina; Bryce, George; Vaes, Jan; van Drieenhuizen, Bert; Witvrouw, Ann (2008)

Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures

Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Vandervorst, Alain; Claes, Martine; Lux, Marcel; Versluijs, Janko; Alaerts, Wilfried; Van Besien, Els; Deweerdt, Bruno; Vaes, Jan; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, A.; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2008)

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

Van Olmen, Jan; Huyghebaert, Cedric; Coenen, Jens; Van Aelst, Joke; Sleeckx, Erik; Van Ammel, Annemie; Armini, Silvia; Vaes, Jan; Beyne, Eric; Travaly, Youssef (2010)

Novel patterning shrink technique enabling sub-50nm trench and contact integration

Demuynck, Steven; Tokei, Zsolt; Zhao, Chao; de Marneffe, Jean-Francois; Struyf, Herbert; Boullart, Werner; Op de Beeck, Maaike; Carbonell, Laure; Heylen, Nancy; Vaes, Jan; Beyer, Gerald; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Kim, J. S.; Vertommen, Johan; Coenegrachts, Bart; Sadjadi, R.; Pavel, E.; Athayde, A. (2007)