Browsing Articles by imec author "a51a962e3317d6a3af137ed342ed22d602aca54a"
Now showing items 1-17 of 17
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3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018-11) -
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric (2021) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming induced defects on direct bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2018) -
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Park, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung (2022) -
Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Etch process modules development and integration in 3D-SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele (2018) -
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2020) -
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Inoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric (2021) -
Influence of composition of SiCN as interfacial layer on plasma activated direct bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
Influence of Si wafer thinning processes on (Sub)surface defects
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric; Uedono, Akira (2017) -
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Inoue, Fumihiro; Podpod, Arnita; Peng, Lan; Phommahaxay, Alain; Rebibis, Kenneth June; Uedono, Akira; Beyne, Eric (2020) -
Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces
Philipsen, Harold; Jehoul, Hannes; Inoue, Fumihiro; Vandersmissen, Kevin; Yang, Liu; Struyf, Herbert; van Dorp, Dennis (2017) -
Nucleation kinetics of electroless Cu deposition on ruthenium using glyoxylic acid as reducing agent
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2014) -
Role of bath composition in electroless Cu seeding on Co liner for through-Si vias
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu (2015-01) -
Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Nagano, Fuya; Iacovo, Serena; Phommahaxay, Alain; Inoue, Fumihiro; Chancerel, Francois; Naser, Hasan; Beyer, Gerald; Beyne, Eric; De Gendt, Stefan (2022)